Foundries News

• Marvell Extends Data Infrastructure Leadership with TSMC 3nm Platform (Wednesday Oct. 06, 2021)
  Marvell today announced it is extending its data infrastructure silicon leadership with a new advanced silicon platform based on TSMC's 3nm process technology, offering the best power, performance, and area in the industry.
  
  
• Intel Breaks Ground on Two New Leading-Edge Chip Factories in Arizona (Friday Sep. 24, 2021)
  Intel today broke ground on two new leading-edge chip factories at the company’s Ocotillo campus in Chandler, Arizona.
  
  
• GlobalFoundries Unveils Innovative Solutions that Deliver a New Era of More in Semiconductor Manufacturing (Thursday Sep. 16, 2021)
  GlobalFoundries today announced a portfolio of new features that extend its solutions roadmap and accelerate the next wave of innovation in chip design for smart mobile devices, datacenter, IoT and automotive.
  
  
• GlobalFoundries and Qualcomm Sign Agreement to Deliver Advanced 5G RF Front-End Products (Thursday Sep. 16, 2021)
  GlobalFoundries and Qualcomm announced today that they are extending their successful RF collaboration on 5G multi-Gigabit speed RF front-end products for delivering the high cellular speeds, superior coverage, and outstanding power efficiency in the sleek form factors users expect from the newest generation of 5G-enabled products.
  
  
• Elissa Murphy Joins GlobalFoundries Board (Thursday Sep. 16, 2021)
  GlobalFoundries (GF) today announced Elissa Murphy is joining the company’s board of directors with immediate effect as an independent director.
  
  
• Xenergic joins GlobalFoundries FDX Network (Friday Aug. 27, 2021)
  Xenergic announced today that they have joined the GlobalFoundries (GF) FDX Network and Design Enablement Network. Xenergic’s memory compiler for on-chip memories, MemoryTailor®, is available for GF customers in GF 22FDX® technology.
  
  
• Intel Wins US Government Project to Develop Leading-Edge Foundry Ecosystem (Wednesday Aug. 25, 2021)
  
  
  
• BAE Systems collaborates with GlobalFoundries to produce radiation-hardened single board computers for space (Monday Aug. 23, 2021)
  BAE Systems’ radiation-hardened RAD510™ System on Chip (SoC) for space-based computing is entering fabrication. Designed by BAE Systems and manufactured by GlobalFoundries® (GF®), the RAD510 SoC will be the core of a single board computer (SBC) with twice the performance capability of the industry standard RAD750® microprocessor.
  
  
• TSMC Shareholders Elect Board of Directors; Board of Directors Unanimously Re-elects Dr. Mark Liu as Chairman and Dr. C.C. Wei as CEO and Vice Chairman (Monday Jul. 26, 2021)
  TSMC Shareholders Elect Board of Directors; Board of Directors Unanimously Re-elects Dr. Mark Liu as Chairman and Dr. C.C. Wei as CEO and Vice Chairman
  
  
• GlobalFoundries Plans to Build New Fab in Upstate New York in Private-Public Partnership to Support U.S. Semiconductor Manufacturing (Tuesday Jul. 20, 2021)
  GlobalFoundries (GF), the global leader in feature-rich semiconductor manufacturing, today announced its expansion plans for its most advanced manufacturing facility in upstate New York over the coming years.
  
  
• GLOBALFOUNDRIES Breaks Ground on New Fab in Singapore (Tuesday Jun. 22, 2021)
  GLOBALFOUNDRIES® (GF®), the global leader in feature-rich semiconductor manufacturing, today announced it is expanding its global manufacturing footprint with the construction of a new fab on its Singapore campus. 
  
  
• Bosch opens wafer fab of the future in Dresden (Thursday Jun. 10, 2021)
  Fully connected, data-driven, self-optimizing: in Dresden, Bosch is opening one of the world’s most modern wafer fabs. Highly automated, fully connected machines and integrated processes, combined with methods of artificial intelligence (AI) will make the Dresden plant a smart factory and a trailblazer in Industry 4.0.
  
  
• Samsung Successfully Completes 8nm RF Solution Development to Strengthen 5G Communications Chip Solutions (Thursday Jun. 10, 2021)
  New 8nm RF chip architecture provides up to 35 percent increase in power efficiency and 35 percent decrease in logic area compared to 14nm RF
  
  
• GLOBALFOUNDRIES and GlobalWafers Partnering to Expand Semiconductor Wafer Supply (Tuesday Jun. 08, 2021)
  Long-term $800 million supply deal includes $210 million capital expansion, creation of more than 75 new jobs in Missouri and will provide specialized wafers for GF’s manufacturing facilities in New York and Vermont
  
  
• NXP Ramps Automotive Processing Innovation with Two Processors on TSMC 16nm FinFET Technology (Wednesday Jun. 02, 2021)
  NXP Semiconductors N.V. (NASDAQ: NXPI), a world leader in automotive processing, and TSMC (TWSE: 2330, NYSE: TSM) today announced the release of NXP’s S32G2 vehicle network processor and the S32R294 radar processor into volume production on TSMC’s advanced 16 nanometer (nm) FinFET process technology.
  
  
• TSMC Unveils Innovations at 2021 Online Technology Symposium (Wednesday Jun. 02, 2021)
  Debuts N6RF for enhanced 5G smartphone experience, N5A for state-of-the-art automotive, and new 3DFabric technologies
  
  
• Raytheon Technologies and GLOBALFOUNDRIES Partner to Accelerate 5G Wireless Connectivity (Wednesday May. 19, 2021)
  Raytheon Technologies and GLOBALFOUNDRIES will collaborate to develop and commercialize a new gallium nitride on silicon (GaN-on-Si) semiconductor that will enable game-changing radio frequency performance for 5G and 6G mobile and wireless infrastructure applications.
  
  
• PsiQuantum and GLOBALFOUNDRIES to Build the World's First Full-scale Quantum Computer (Wednesday May. 05, 2021)
  PsiQuantum and GLOBALFOUNDRIES today announced a major breakthrough in their partnership to build the world’s first full-scale commercial quantum computer.
  
  
• First Google-Sponsored MPW Shuttle Launched at SkyWater with 40 Open Source Community Submitted Designs (Tuesday Apr. 06, 2021)
  SkyWater Technology, the trusted technology realization partner, and Efabless, a crowdsourcing design platform for custom silicon, today announced the first tapeout in a series of Google-sponsored open source multi-project wafer (MPW) shuttles, managed by Efabless and manufactured at SkyWater.
  
  
• Compound Photonics Partners with GLOBALFOUNDRIES to Manufacture World's First Monolithic Microdisplay for Real-Time AR (Wednesday Mar. 10, 2021)
  Compound Photonics US Corporation (CP, also known as CP Display), a leader in microdisplay solutions for Augmented/Mixed Reality (AR/MR), and GLOBALFOUNDRIES® (GF®), the world’s leading specialty foundry, today announced a strategic partnership to manufacture IntelliPix™, CP’s microdisplay technology platform.
  
  
• GLOBALFOUNDRIES 22FDX RF Solution Provides the Basis for Next-Gen mmWave Automotive Radar (Tuesday Mar. 09, 2021)
  GLOBALFOUNDRIES® (GF®), the global leader in specialty semiconductor manufacturing, and Bosch will partner to develop and manufacture next-generation automotive radar technology.
  
  
• U.S. Department of Defense Partners with GLOBALFOUNDRIES to Manufacture Secure Chips at Fab 8 in Upstate New York (Monday Feb. 15, 2021)
  Now fully ITAR compliant, GF’s most advanced manufacturing facility will produce semiconductor solutions for the nation’s most sensitive defense and aerospace applications
  
  
• Announcement of SMIC (Monday Dec. 07, 2020)
  On 4 December 2020, the Company noticed that the Company was added to the list of Chinese military companies by the United States Department of Defense.
  
  
• Driven by Accelerating Demand for Leading 5G RF Solutions, GLOBALFOUNDRIES and Soitec Announce RF-SOI Wafer Supply Agreement (Friday Nov. 06, 2020)
  GLOBALFOUNDRIES® (GF®), the world’s leading specialty foundry, and Soitec, a world leader in designing and manufacturing innovative semiconductor materials, today announced a multi-year supply agreement for 300mm radio frequency silicon-on-insulator (RF-SOI) wafers.
  
  
• 55 BCDLite Solution Positions GLOBALFOUNDRIES for Continued Leadership in Audio Amplifiers for Mobile Devices (Wednesday Nov. 04, 2020)
  GLOBALFOUNDRIES® (GF®) announced that it has shipped more than 3 billion units of its 55 BCDLite® specialized semiconductor solution, which is found in five of the seven leading top-tier smartphones currently on the market.
  
  
• EvoNexus and GLOBALFOUNDRIES Team to Accelerate Growth of Wireless and IoT Startups (Monday Oct. 26, 2020)
  EvoNexus, a leading non-profit technology incubator, and GLOBALFOUNDRIES® (GF®), the world’s leading specialty semiconductor foundry, today announced their collaboration to accelerate the growth of semiconductor startups developing breakthrough products in wireless and the Internet of Things (IoT). EvoNexus has extensive history and success incubating startups across the wireless ecosystem.
  
  
• TSMC Announces 2020 OIP Partner of the Year Awards for Excellence in Accelerating Silicon Innovation (Tuesday Oct. 20, 2020)
  TSMC (TSE: 2330, NYSE: TSM) today recognized the outstanding achievements of 10 EDA, IP, and Cloud Alliance partners with the distinction of OIP Partner of the Year.
  
  
• GLOBALFOUNDRIES Accelerating Innovation in IoT and Wearables with Adaptive Body Bias Feature on 22FDX Platform (Thursday Oct. 15, 2020)
  GF customers working in IoT, wearables, RF, and edge computing are leveraging ABB to further boost the efficiency of their designs by utilizing the 22FDX platform’s ultra-low power and low leakage capabilities
  
  
• GLOBALFOUNDRIES and Movano Inc. Partner to Advance Needle-Free Continuous Glucose Monitoring Technology (Monday Sep. 28, 2020)
  Movano today announced a strategic collaboration with GLOBALFOUNDRIES® (GF®) to advance the commercialization of Movano’s wearable, non-invasive continuous glucose monitor (CGM), which is currently in development.
  
  
• 28HV Solution Accelerates GLOBALFOUNDRIES Leadership in OLED Display Drivers for Mobile Devices (Monday Sep. 28, 2020)
  GLOBALFOUNDRIES® (GF®) today announced it has shipped more than 75 million units of its new 28HV specialized semiconductor solution for organic-light emitting diode (OLED) display drivers to suppliers of leading smartphone makers.