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IP / SOC Products News

• Intrinsic ID Introduces CITADEL, the SRAM PUF-based Key Provisioning System that Breaks the Barriers of IoT Security (Monday Feb. 13, 2017)
  Intrinsic ID, a leading provider of authentication technology, announced today the availability of CITADEL™, an SRAM Physical Unclonable Function (PUF)-based Key Provisioning System. CITADEL provides unparalleled strength, flexibility and affordability in a package that includes hardware or software IP, manufacturing tools and an OEM management suite.
  
  
• Rambus Introduces High Bandwidth Memory PHY on GLOBALFOUNDRIES FX-14 ASIC Platform using 14nm LPP Process Technology (Wednesday Feb. 08, 2017)
  Built on the GLOBALFOUNDRIES 14nm FinFET (14LPP) process technology, the Rambus HBM PHY is aimed at networking and data center applications and designed for systems that require low latency and high bandwidth memory.
  
  
• eMemory Qualified NeoFuse in TSMC 16FFC Process (Wednesday Feb. 08, 2017)
  World-leading NVM IP provider eMemory announces the availability of NeoFuse technology, qualified in TSMC’s 16nm FinFET Compact (16FFC) process. Customers have already embedded the NeoFuse IP for product tape-out. eMemory’s rapid development in 16nm FinFET process variants such as 16nm FinFET Plus (16FF+) and 16FFC has proven the quality of NeoFuse IP.
  
  
• Significant IP-core Announcements for Omnitek (Tuesday Feb. 07, 2017)
  Omnitek, a world leading supplier of FPGA based video IP and turnkey design solutions announces significant new IP releases at Integrated Systems Europe, 7-10 February - RAI Amsterdam, Booth 14-B132.
  
  
• Flex Logix Qualifies Serial I/O IP From CAST And SOC Solutions For EFLX Embedded FPGA (Monday Feb. 06, 2017)
  
  
  
• R-Stratus-LP silicon IP reduces significantly power consumption of flash memories (Monday Feb. 06, 2017)
  Connected battery-based devices require always more computing power to run feature rich application programs while using the minimal energy to ensure the longest usage without recharge. As a result, fabless companies need to hunt down every "mA" to satisfy the low-power expectations of their SoC users.
  
  
• GUC Unveils Solid State Drive ASIC Capabilities (Thursday Feb. 02, 2017)
  The company's SSD solution covers application-specific front end design capabilities, advanced node design flow experience, robust manufacturing management, and a production-proven IP set targeting TSMC 28HPC+ process technologies.
  
  
• Rambus Unveils 56G SerDes PHYs on Leading-Edge FinFET Technology (Wednesday Feb. 01, 2017)
  Rambus Inc. (NASDAQ:RMBS) today announced its industry-leading 56G SerDes PHY which delivers enterprise-class performance across the challenging signal environments typical of high-speed communication systems. Developed on cutting-edge second generation FinFET (Fin Field Effect Transistor) process technology, this solution meets the growing demands of communications and data center applications.
  
  
• Mn_nH release 360 degree image stitching IP for VR camera SoC. (Thursday Jan. 26, 2017)
  The global market of virtual reality is growing more and more, it expand to mixed reality also. There have been many attempts to make VR / MR renovation products as VR headset, controller and VR camera in 2016.
  
  
• Imagination's new PowerVR GPUs deliver leading performance in lowest area for mid-range markets (Wednesday Jan. 18, 2017)
  Imagination Technologies (IMG.L) announces a new family of GPUs that provides the ideal balance of performance and fillrate needed to enable gaming and compute applications on cost-sensitive devices.
  
  
• New Video Compressor and Camera Processor Cores Expand CAST's IP Line (Wednesday Jan. 18, 2017)
  CAST, Inc. recently added two media processing cores to its extensive line of semiconductor intellectual property cores and subsystems.
  
  
• Beyond Semiconductor partners with Rubicon Labs to deliver full stack solution for cryptographically secure execution processor (Tuesday Jan. 17, 2017)
  Beyond Semiconductor today announced a strategic collaboration with Rubicon Labs. Developed over the past three years, the partnership combines Rubicon Labs’ cloud based device identity and security platform with Beyond Semiconductor’s processor and secure system-wide design competence to deliver security and identity for IoT, IIoT and data center ecosystems
  
  
• Crossbar ReRAM in production at SMIC (Monday Jan. 16, 2017)
  Crossbar Inc. (Santa Clara, Calif.), a developer of non-volatile resistive RAM (ReRAM) based on silver-over-amorphous-silicon technology kept its promise to be in production in 2016.
  
  
• Moortec Announce Embedded Temperature Sensor on TSMC 16FF+ & FFC (Monday Jan. 16, 2017)
  Moortec Semiconductor, specialists in Process, Voltage and Temperature (PVT) sensors, announce the availability of their Embedded Temperature Sensor on TSMC’s 16nm FF+ and FFC processes.
  
  
• Trilinear Technologies Adds Display Stream Compression (DSC) Encode and Decode Solutions to IP Portfolio (Monday Jan. 16, 2017)
  
  
  
• Arasan Announces Total IP Solution for MIPI I3C Standard (Tuesday Jan. 10, 2017)
  Arasan Chip Sytems announces the immediate availability of its MIPI I3C Master & Slave IP cores compliant to the just released MIPI I3C Specification Ver 1.0.
  
  
• CSEM announces Bluetooth 5-ready silicon RF IP (Wednesday Jan. 04, 2017)
  CSEM’s IcyTRX silicon RF IP is the first Bluetooth Low Energy RF to be fully validated as Bluetooth 5 compatible thanks to a partnership with Rohde & Schwarz.
  
  
• Trilinear Technologies Advances Industry Leading DisplayPort Transmitter and Receiver Link Controllers (Tuesday Jan. 03, 2017)
  Continuing the highly successful line of DisplayPort link controller cores, the Trilinear VF-111T DisplayPort Transmitter and VF-117R DisplayPort Receiver cores have been updated to include full support for the Video Electronic Standards Association (VESA) DisplayPort 1.4 standard.
  
  
• IPrium releases 40G I.3 Encoder/Decoder for DWDM systems (Wednesday Dec. 28, 2016)
  
  
  
• Arastu System's LPDDR3 Controller Core for Extended Battery Life (Friday Dec. 23, 2016)
  Arastu Systems, a company that specializes in developing IPs in the Memory and Networking area today announced the immediate availability of their LPDDR3 DRAM Memory Controller along with LPDDR4, that is optimized for FPGA and ASIC designs.
  
  
• FotoNation and VeriSilicon Collaborate on Next Generation, Advanced Computer Vision and Computational Imaging Platform (IPU2.0) (Wednesday Dec. 21, 2016)
  Tessera today announced that its wholly owned subsidiary, FotoNation Limited, and VeriSilicon Holdings Co., Ltd. (“VeriSilicon”), have entered into an agreement to jointly develop a next generation image processing platform that offers best-in-class programmability, power, performance and area for computer vision (CV), computational imaging (CI) and deep learning
  
  
• Imagination's PowerVR GPU is first to pass OpenVX 1.1 conformance with Khronos (Friday Dec. 16, 2016)
  Imagination Technologies (IMG.L) announces that a PowerVR GPU is the first to achieve Khronos OpenVX™ 1.1 conformance. With OpenVX, developers can run fully optimized vision algorithms on the highly parallel, power-efficient PowerVR GPUs that are at the heart of many of the world’s mobile, automotive and embedded devices.
  
  
• Imagination's Ensigma wireless communications IP now Wi-Fi CERTIFIED on chip that powers Creator Ci40 board (Thursday Dec. 15, 2016)
  Imagination Technologies (IMG.L) announces that its high-performance Ensigma Explorer wireless communications IP has once again achieved Wi-Fi CERTIFIED™ status. Certification was achieved this time via a reference design using the CxT200 chip which powers the Creator Ci40 development board.
  
  
• Silicon-proven HBM Gen2 Hardened PHY from eSilicon (Thursday Dec. 15, 2016)
  eSilicon today announced the availability of its silicon-proven 14nm FinFET and 28nm planar HBM Gen2 Hardened PHY solution. High-bandwidth memory (HBM), integrated with 2.5D technology, achieves higher bandwidth while using less power in a substantially smaller form factor than DDR4, GDDR5 or hybrid memory cube (HMC).
  
  
• Microsemi Adds IP for Resolver Sensors to FPGA-Based Multi-Axis Motor Control Solution Targeting Aerospace and Defense, Automotive and Industrial Applications (Thursday Dec. 15, 2016)
  Microsemi today announced new enhancements to its field programmable gate array (FPGA)-based deterministic multi-axis motor control solution, with two new intellectual property (IP) offerings, a Resolver interface and a Sinc3 filter, both to support designs using resolver sensors.
  
  
• Faraday Readies MCU ASIC Migration Path with 55nm eFlash (Thursday Dec. 15, 2016)
  Faraday Technology Ctoday announced its 55nm eFlash-based ASIC solution is ready to support better MCU performance. By skipping 90nm, Faraday's MCU ASIC path strides directly from 8-inch 0.11μm to 12-inch 55nm eFlash process node, offering much lower power/leakage and significant performance gain.
  
  
• Flex Logix High-Performance Embedded FPGA IP Core Now Available for TSMC 16FF+ and 16FFC (Tuesday Dec. 13, 2016)
  Flex Logix Technologies, Inc., the leading developer of embedded FPGA IP cores and software, today announced it has completed design of a high-performance IP core for TSMC 16FF+ and 16FFC, with performance for wide, single-stage logic around ~1GHz at worst case PVT conditions.
  
  
• Alizem Releases its New DC Motor Control Embedded Software IP for Intel MAX 10 FPGAs (Tuesday Dec. 13, 2016)
  Alizem today announced the release of its new embedded software IP optimized for Intel® MAX® 10 FPGAs, and designed to be used in DC motor applications such as robotics, drones, medical devices, instrumentation devices and consumer products.
  
  
• Moortec Announce Embedded Voltage Monitor on TSMC 16FF+ and FFC Processes (Monday Dec. 12, 2016)
  Moortec Semiconductor, specialists in Process, Voltage and Temperature (PVT) sensors, announce the availability of their Embedded Voltage Monitor on TSMC’s 16nm FF+ and FFC processes.
  
  
• ARM Offers Support For TSMC 7nm Manufacturing (Friday Dec. 09, 2016)
  ARM Ltd. announced the availability for evaluation and licensing of its Artisan physical IP platform for the 7nm 7FF FinFET process from TSMC, as well as a design win at that level with Xilinx Inc.