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• China to have 30% of foundry capacity by 2030 (Thursday, June 26, 2025)
• Semiconductor foundry landscape to transform by 2030 (Wednesday, June 25, 2025)
• Samsung Reportedly Prioritizes 2nm/4nm Improvements, with 1.4nm Unlikely Before 2028-29 (Wednesday, June 25, 2025)
• Global Semiconductor Foundry 2.0 Market’s Q1 2025 Revenue Jumps 13% YoY Driven by AI Chip Demand (Tuesday, June 24, 2025)
• Samsung Foundry Postpones 1.4nm Trial Line Investment, Focuses on 2nm (Tuesday, June 24, 2025)
• Rapidus announces collaboration with Siemens for 2nm semiconductor design (Monday, June 23, 2025)
• SMIC - Beneficiary of China's Semiconductor Self-Sufficiency Drive (Sunday, June 22, 2025)
• Imec and Tokyo Electron extend partnership to accelerate the development of beyond-2nm nodes (Monday, June 16, 2025)
• TSMC's Phenomenal 2nm Yield Rates Would Likely Put Alternatives From Samsung & Intel Foundry Way Behind; Apple, NVIDIA & AMD to Be Major Customers (Monday, June 16, 2025)
• TSMC: King Of Data Center AI (Monday, June 16, 2025)
• Samsung, TSMC set stage for fierce race in 2nm chip tech (Sunday, June 15, 2025)
• Samsung Foundry Struggles With 3nm Yields at 50% as TSMC Climbs Past 90% (Friday, June 13, 2025)
• "TSMC-UTokyo Lab" Launched to Promote Advanced Semiconductor Research, Education and Talent Incubation (Thursday, June 12, 2025)
• TSMC Achieves 90% Yield in 2nm Memory Chip Production (Thursday, June 5, 2025)
• Intel Foundry Direct Connect 2025 Expands Roadmap And Partnerships (Thursday, June 5, 2025)
• GlobalFoundries Announces $16B U.S. Investment to Reshore Essential Chip Manufacturing and Accelerate AI Growth (Thursday, June 5, 2025)
• Making Technology Real: GlobalFoundries' Vision for the Future (Monday, June 2, 2025)
• TSMC to Open EU Design Center in Munich in Q3 (Thursday, May 29, 2025)
• TSMC dazzles in Amsterdam (Wednesday, May 28, 2025)
• TSMC to Open First European Design Center in Munich by Q3 2025, Focusing on AI and Automotive (Wednesday, May 28, 2025)
• AMD sees TSMC as the clear favorite for 2nm, but Samsung remains in the game (Monday, May 26, 2025)
• Samsung to use Glass Substrate for Semiconductor manufacturing in 2028 (Sunday, May 25, 2025)
• GlobalFoundries partners with A*STAR to accelerate advanced packaging innovation (Thursday, May 22, 2025)
• GlobalFoundries partners with A*STAR to accelerate advanced packaging innovation (Tuesday, May 20, 2025)
• Samsung Reportedly Revises High-NA EUV Plans: Limited Memory Use, Foundry Begins at 1.4nm (Friday, May 16, 2025)
• Synopsys ramps up collaboration with Taiwan's TSMC on A16 process (Wednesday, May 14, 2025)
• SMIC Q2 revenues to take 6% hit due to tool maintenance and validation issues (Tuesday, May 13, 2025)
• Rapidus Starts Path to Advanced Chipmaking in Japan Government-backed startup's 2-nanometer pilot production gets underway (Wednesday, May 7, 2025)
• EDA Companies Throw Support Behind TSMC's New A14 Process (Wednesday, May 7, 2025)
• Enabling the next generation of smart glasses (Wednesday, April 30, 2025)
• IC'Alps joins Intel Foundry Accelerator program as Value Chain Alliance (VCA) and Design Services Alliance (DSA) partner (Wednesday, April 30, 2025)
• Intel tweaks its 18A process with variants tailored to mass-market chips, big AI brains (Wednesday, April 30, 2025)
• Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs (Wednesday, April 30, 2025)
• SkyeChip Joins Intel Foundry Accelerator IP Alliance (Wednesday, April 30, 2025)
• Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC (Wednesday, April 30, 2025)
• Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications (Wednesday, April 30, 2025)
• Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies (Wednesday, April 30, 2025)
• Keysight EDA and Intel Foundry Collaborate on EMIB-T Silicon Bridge Technology for Next-Generation AI and Data Center Solutions (Tuesday, April 29, 2025)
• Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale (Monday, April 28, 2025)
• Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration (Monday, April 28, 2025)
• QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip (Monday, April 28, 2025)
• Certus Semiconductor Joins TSMC IP Alliance Program to Enhance Custom I/O and ESD Solutions (Wednesday, April 23, 2025)
• Analog Bits to Demonstrate IP Portfolio on TSMC 3nm and 2nm Processes at TSMC 2025 Technology Symposium  (Monday, April 21, 2025)
• Analog Bits to Demonstrate IP Portfolio on TSMC 3nm and 2nm Processes at TSMC 2025 Technology Symposium (Monday, April 21, 2025)
• Samsung achieves 40%+ test yields with 4nm logic die (Wednesday, April 16, 2025)
• AMD Achieves First TSMC N2 Product Silicon Milestone (Wednesday, April 16, 2025)
• Samsung Reportedly Begins 1nm Process Development, Targets 2029 Mass Production (Thursday, April 10, 2025)
• Silicon Photonics and Co-Packaged Optics Shine a Light at OFC 2025 (Thursday, April 3, 2025)
• Japan's Rapidus in talks with Apple, Google to mass-produce chips, Nikkei reports (Thursday, April 3, 2025)
• Major Manufacturing Shake-up: Intel Agrees to TSMC Takeover of Chip Foundries, Sources Say (Thursday, April 3, 2025)