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• TSMC Invests $1 Billion in OpenAI, Anthropic (Thursday, November 12, 2026)
• "Competition Is Already Fierce": Japan’s Rapidus Faces Concerns Over Delayed 2nm Mass Production, With Returns on Massive Government Investment Uncertain (Thursday, November 12, 2026)
• FD-SOI, challenging 7nm, what makes it possible? (Monday, November 9, 2026)
• Samsung Foundry Taps Taiwan Partner Faraday to Land 2nm Cloud AI Chip Deal (Monday, November 9, 2026)
• What Is the Intel 14A PDK 0.9, and Why Does It Matter to Foundry Customers? (Monday, November 9, 2026)
• Samsung Electronics to Exit 8-Inch Foundry Business by 2030 (Thursday, November 5, 2026)
• MicroBias: Integrated micromagnets enable precise, miniaturized magnetic sensor systems (Thursday, November 5, 2026)
• TSMC plans A14 production for 2028; reported SRAM goal could mean over 19% less bit-cell area (Monday, November 2, 2026)
• Rapidus and HCLTech announce partnership for next-generation semiconductor technologies (Thursday, October 29, 2026)
• Purdue, GlobalFoundries expand partnership with master research agreement (Thursday, October 29, 2026)
• GlobalFoundries launches Advanced Facilities Control Centre in Singapore (Thursday, October 29, 2026)
• Samsung targets 2nm M2800 as Qualcomm evaluates its foundry (Monday, October 26, 2026)
• Samsung Prepares Next-Gen 8nm Foundry Technology with Major Improvements (Monday, October 26, 2026)
• UMC and AP Memory Collaborate to Enable Advanced Power Delivery Solutions for AI and HPC Systems (Monday, October 26, 2026)
• Can GFS' Manufacturing Expansion Boost Its Future Growth Prospects? (Thursday, October 22, 2026)
• Scaling infrastructure, all-in on NPO, and a "material-rich" road map: Themes and takeaways from Soitec’s 2026 Silicon Photonics Workshop (Thursday, October 22, 2026)
• IBM and Siemens team up to advance 3D nanostack chip technology (Monday, October 19, 2026)
• TSMC to Double 2nm Production Capacity by 2027, Widening Gap with Samsung Foundry to 66.6 Percentage Points (Monday, October 19, 2026)
• Samsung May Acquire a Silicon Photonics Company to Challenge TSMC (Monday, October 19, 2026)
• GlobalFoundries selected to operate two new semiconductor fabs in New York under landmark U.S.-Japan initiative (Thursday, October 15, 2026)
• GlobalFoundries Returns to Advanced-Node Race With 7 nm-Class FDX Fusion (Thursday, October 15, 2026)
• Cadence Wins Five 2026 TSMC OIP Partner of the Year Awards (Thursday, October 15, 2026)
• Manfred Horstmann: GlobalFoundries Bets on FDX Fusion for Physical AI (Monday, October 12, 2026)
• GF unveils roadmap to deliver the world’s most advanced FD-SOI platform for Physical AI (Monday, October 12, 2026)
• GlobalFoundries reaches agreement to establish U.S.-based supply of silicon interposers for advanced AI packaging (Monday, October 12, 2026)
• Xanadu and GlobalFoundries Announce Strategic Partnership to Accelerate Utility-Scale Quantum Manufacturing (Thursday, October 8, 2026)
• SkyeChip joins Rapidus ecosystem for Japan's 2nm chip platform (Thursday, October 8, 2026)
• Aion Silicon Named Design Solution Associate in New Rapidus CORE Ecosystem for 2nm Semiconductors (Wednesday, October 7, 2026)
• Rapidus Unveils "Rapidus CORE", New Global Ecosystem Framework Supporting the Development and Mass Production of Cutting-Edge Semiconductors (Monday, October 5, 2026)
• Panther Lake Teardown Shows Intel 18A Near TSMC N3E, Newer TSMC Nodes Still Ahead (Monday, October 5, 2026)
• Synopsys Earns Five TSMC Open Innovation Platform Partner of the Year Awards for Advancing AI-Driven Semiconductor Innovation (Monday, October 5, 2026)
• TSMC’s 3-nm Ramp Looks Different in Historical Context (Thursday, October 1, 2026)
• Silicon Creations Receives 10th Consecutive TSMC OIP Partner of the Year Award for Mixed Signal IP (Thursday, October 1, 2026)
• Samsung considers expanding 4nm capacity as HBM4 demand rises (Monday, September 28, 2026)
• SMART Photonics Partners with GlobalFoundries to Offer Industry’s First Open Access Foundry Service for Integrated Silicon and Indium Phosphide Photonics Products (Thursday, September 24, 2026)
• IC-Link by imec expands collaboration with TSMC to accelerate customer access to advanced-node chip design infrastructure and support (Thursday, September 24, 2026)
• M31 and Ambiq Collaborate on TSMC N12e® Foundation IP to Address Demanding SoC Power and Area Targets (Thursday, September 24, 2026)
• Siemens and TSMC advance AI-powered semiconductor design automation (Thursday, September 24, 2026)
• Cadence Collaborates With TSMC to Deliver Certified Tool Solutions and Industry-Leading, Silicon-Proven UALink IP on TSMC Advanced Processes (Thursday, September 24, 2026)
• Synopsys and TSMC Partner to Accelerate AI Systems Innovation with Agentic AI and Advanced Design (Thursday, September 24, 2026)
• GlobalFoundries and Marvell expand collaboration for next-generation optical connectivity (Monday, September 21, 2026)
• Samsung Starts 2nm AI5 Chip Production for Tesla FSD and Optimus (Monday, September 21, 2026)
• TSMC Scores Another 2nm Win: MediaTek's Dimensity 9600 Pro to Use N2P Process (Monday, September 21, 2026)
• Samsung and Qualcomm reopen 2nm talks as yield gap with TSMC narrows (Wednesday, September 16, 2026)
• GlobalFoundries and Monolithic Power Systems form manufacturing partnership to scale high-performance power solutions (Monday, September 14, 2026)
• SMIC Outgrows TSMC and Samsung With 20% Surge, Overtaking GlobalFoundries as World’s Third-Largest Foundry (Monday, September 14, 2026)
• Intel Resolves 18A Yield Variability; A Storm to Engulf Samsung and TSMC? (Monday, September 14, 2026)
• Samsung Electronics and ASML expand strategic collaboration for next-generation semiconductor manufacturing (Thursday, September 10, 2026)
• Intel Foundry and ASML Collaborate to Accelerate Industry Readiness for High NA EUV (Thursday, September 10, 2026)
• ASML and TSMC Announce Initiative to Pioneer Industry Transition to Large-Format Photomasks for High NA EUV (Thursday, September 10, 2026)