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May. 23, 2017 -
GLOBALFOUNDRIES and the Chengdu municipality today announced an investment to spur innovation in China’s semiconductor industry. The partners plan to build a world-class FD-SOI ecosystem including multiple design centers in Chengdu and university programs across China.
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May. 17, 2017 -
Samsung Electronics’ plan to spin off foundry operations from the system LSI division is expected to increase Samsung’s share of global contract chipmaking at the expense of Taiwan Semiconductor Manufacturing Co. (TSMC) and smaller rivals.
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May. 09, 2017 -
Sonics and Northwest Logic today announced their partnership to deliver high throughput memory subsystem solutions for complex System-On-Chip (SOC) designs.
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May. 09, 2017 -
In total, the top-10 semiconductor suppliers represented 56% of the 1Q17 worldwide semiconductor market of $99.6 billion (2Q17 is forecast to be the first ever quarterly semiconductor market to exceed $100 billion).
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Apr. 26, 2017 -
Sonics and Wave Computing today announced that the companies will jointly deliver a technical presentation on Deep Learning technology at the Machine Learning Developers Conference on Thursday, April 27th 2017.
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Apr. 14, 2017 -
Taiwan Semiconductor Manufacturing Co. (TSMC), the largest foundry for customers in the smartphone business including Apple and MediaTek, says it is expecting an inventory correction in smartphones to continue through the first half of this year.
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Apr. 07, 2017 -
Valens, the developer of HDBaseT and co-founder of the HDBaseT Alliance, announced it has secured an additional $60 million in capital, to fuel the company’s inroads into the automotive industry with its ground-breaking HDBaseT technology.
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Apr. 05, 2017 -
Cadence today announced the release of the new Virtuoso® Advanced-Node Platform supporting advanced 7nm designs. Through collaboration with early 7nm FinFET customers, Cadence has expanded the Virtuoso custom design platform with innovative new capabilities to manage design complexity and process effects ...
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Mar. 27, 2017 -
PLDA today announced a series of major licenses for their XpressSWITCH™ PCIe switch IP, confirming the expansion of PCIe-embedded switches. These licenses enable several major SoC and system vendors to solve their cost, flexibility, integration, and end-of-life issues by integrating a PLDA sub-system ...
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Mar. 22, 2017 -
Samsung appears to be about a quarter ahead of Taiwan Semiconductor Manufacturing Co. (TSMC) with the ramp of 10-nm process technology, according to a veteran chip analyst.
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Mar. 15, 2017 -
Sonics today introduced ICE-G3™, the second product in the Energy Processing Unit (EPU) family based on the ICE-Grain Power Architecture™.
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Mar. 07, 2017 -
One of a handful of startups aiming to attack Broadcom’s dominance in Ethernet switching emerges from stealth mode this week. Nephos spun out of Taiwan’s Mediatek and will push packaging technology from TSMC to a new level.
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Feb. 23, 2017 -
Sonics today announced that Goke Microelectronics, a leading Chinese provider of IP camera, STB, SSD, and IoT chips, has licensed the flagship SonicsGN® NoC along with the MemMax® memory scheduler IP. Goke will use Sonics’ IP products in development of an SoC platform targeted for STB designs.
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Feb. 20, 2017 -
Intel continued to top all other chip companies in R&D expenditures in 2016 with spending that reached $12.7 billion and represented 22.4% of its semiconductor sales last year. Intel accounted for 36% of the top-10 R&D spending and about 23% of the $56.5 billion total worldwide semiconductor R&D expenditures ...
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Feb. 10, 2017 -
GLOBALFOUNDRIES today announced plans to expand its global manufacturing footprint in response to growing customer demand for its comprehensive and differentiated technology portfolio. The company is investing in its existing leading-edge fabs in the United States and Germany, expanding its footprint ...
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Feb. 07, 2017 -
Sonics today announced that Nexell has implemented the flagship SonicsGN® NoC as the integration fabric in its recently introduced NXP5540 application processor.
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Jan. 26, 2017 -
Sonics today announced it will collaborate with GLOBALFOUNDRIES on energy processing unit (EPU) product development that leverages the power and performance optimization capabilities of the 22FDX® process technologies for the system-on-chip (SoC) design community.
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Jan. 18, 2017 -
Worldwide semiconductor revenue totaled $339.7 billion in 2016, a 1.5 percent increase from 2015 revenue of $334.8 billion, according to preliminary results by Gartner, Inc..
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Jan. 12, 2017 -
Worldwide semiconductor capital spending is projected to increase 2.9 percent in 2017, to $69.9 billion, according to Gartner, Inc. This is down from 5.1 percent growth in 2016.
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Jan. 09, 2017 -
The MIPI®Alliance today released MIPI I3CSM, Improved Inter-Integrated Circuit, a sensor interface specification that streamlines sensor integration in smartphones, wearables, Internet of Things (IoT) devices and automotive systems.
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Dec. 07, 2016 -
Synopsys today announced 2nd generation technology that enables semiconductor design teams to adopt a smarter, more efficient hierarchical approach to static timing analysis (STA) for timing closure and signoff across all design sizes and levels of complexity.
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Nov. 16, 2016 -
The top-20 ranking includes three pure-play foundries (TSMC, GlobalFoundries, and UMC) and five fabless companies. If the three pure-play foundries were excluded from the top-20 ranking, U.S.-based fabless supplier AMD ($4,238 million), China-based fabless supplier HiSilicon ($3,762 million), and Japan-based ...
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Oct. 19, 2016 -
Cadence Design Systems, Inc. (NASDAQ: CDNS) today announced it will showcase ARM®-optimized solutions from chips to boards to systems at ARM TechCon 2016.
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Oct. 10, 2016 -
Sonics today announced that it has developed the IP industry’s first Energy Processing Unit (EPU) based on the company’s ICE-Grain™ (Instant Control of Energy) Power Architecture originally introduced in 2015.
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Oct. 03, 2016 -
Sonics, Inc. and Semico Research Corporation have launched the “On-Chip Power Management Best Practices” survey. The purpose of this industry survey is to understand how chip designers are managing power consumption and contrast that with expected future best practices. The companies will publish ...
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Sep. 19, 2016 -
A teardown posted today confirmed Apple put Intel inside at least some of its iPhone 7 handsets, using the x86 giant’s baseband processors acquired from Infineon. The report said Apple used TSMC to make at least some of its A10 Fusion SoCs, probably using its InFO packaging process as well.
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Aug. 23, 2016 -
Sonics, Inc., the world’s foremost supplier of on-chip network (NoC) and power management technologies and services, today announced that Starblaze Technology has completed a new solid state drive (SSD) controller chip using SonicsGN® to integrate more than 60 cores.
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Aug. 17, 2016 -
Linaro Ltd today announced that ArcherMind Technology (Nanjing) Co., Ltd has joined the 96Boards initiative as a Steering Committee Member and Manufacturing Partner and they are preparing the launch of their first 96Boards product.
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Aug. 16, 2016 -
Thirteen of the top-20 companies had sales of at least $3.0 billion in 1H16. It took $1.86 billion in sales just to make it into the 1H16 top-20 semiconductor supplier list.
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Jun. 30, 2016 -
Wi-Fi Alliance® is expanding Wi-Fi CERTIFIED™ ac to include new features that provide a higher-performance mobility experience. New “wave 2” features enable Wi-Fi® to more efficiently handle high-bandwidth applications from an increasing number of smartphones, tablets, TVs, and other consumer ...
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May. 31, 2016 -
The Heterogeneous System Architecture (HSA) Foundation today released the HSA 1.1 specification, significantly enhancing the ability to integrate open and proprietary IP blocks in heterogeneous designs. The new specification is the first to define the interfaces that enable IP blocks from different ...
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May. 30, 2016 -
ARM has announced a suite of premium mobile processor technologies to redefine flagship devices from 2017. The ARM Cortex-A73 processor and the ARM Mali-G71 graphics processor offer sustained performance and efficiency gains that will lead to new products with enhanced contextual and visual capabilities. ...
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May. 03, 2016 -
Sonics today announced that it has developed the IP industry’s first Energy Processing Unit (EPU) based on the company’s ICE-Grain™ (Instant Control of Energy) Power Architecture originally introduced in 2015. Sonics’ ICE-G1™ product is a complete EPU enabling rapid design of system-on-chip ...
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Apr. 01, 2016 -
EE Times Europe interviewed Frankwell Jyh-Ming Lin, CEO of Andes Technology Corp. (Hsinchu, Taiwan), a licensor of a range of 32bit processor cores as intellectual property (IP), and asked how the company is planning to address the European market.
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Feb. 22, 2016 -
PowerVR Series8XE GPUs deliver the best performance/mm2 for the smallest silicon footprint and power profile, while also incorporating advanced features such as hardware virtualization, multi-domain security, and support for the latest APIs including OpenGL® ES 3.2 and Vulkan™ 1.0. Series8XE demonstrates ...
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Feb. 01, 2016 -
The global smartphone Applications Processor (AP) market declined -9 percent year-over-year to reach $5.3 billion in Q3 2015, according to Strategy Analytics Handset Component Technologies service report, "Smartphone Apps Processor Market Share Q3 2015: Samsung LSI Doubles its Shipments Y-o-Y."
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Feb. 01, 2016 -
How much do you know about the processor in your smartphone, or the company behind its creation? The new book "Mobile Unleashed", written by semiconductor industry veterans Daniel Nenni and Don Dingee, delivers an informative look at events and technology that powered the mobile device industry to ...
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Jan. 21, 2016 -
Semiconductor industry spending on research and development grew by just 0.5% in 2015, which was the smallest increase since the 2009 downturn year and significantly below the compound annual growth rate (CAGR) of 4.0% in R&D expenditures during the last 10 years.
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Jan. 12, 2016 -
Sonics today announced that it has signed an agreement with the first customer for the company’s ICE-Grain™ Power Architecture that was introduced in May 2015. The customer, a global player in the consumer electronics and semiconductor industries, will incorporate Sonics’ hardware-based power ...
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Jan. 11, 2016 -
No one talks about the workhorse of the metal gate CMOS transistors -- the input/output (I/O) transistor. TechInsights thinks they are worth a look.