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IP / SOC Products News

• Hardent Delivers Interoperable VESA DSC IP Solution for the New Arm Mali-D71 Processor (Thursday Nov. 02, 2017)
  Hardent today announced a collaboration with Arm to deliver an interoperable VESA DSC IP solution for the new Arm® Mali™-D71 display processor.
  
  
• Synopsys Accelerates FIPS 140-2 Certification with NIST-Validated Cryptography IP Software Library (Thursday Nov. 02, 2017)
  Synopsys, Inc. (Nasdaq: SNPS) today announced it has successfully validated the DesignWare® Cryptography Software Library through the National Institute of Standards and Technology (NIST) Cryptographic Algorithm Validation Program (CAVP).
  
  
• Synopsys' DesignWare STAR Memory System's New Test and Repair Capabilities Speed Embedded Memory Repair Time by 10x (Tuesday Oct. 31, 2017)
  Synopsys today announced a new suite of embedded memory test and repair features for its DesignWare® STAR Memory System® solution to enable increased test coverage and faster power-on initialization for high-performance automotive, mobile and cloud computing system-on-chips (SoCs).
  
  
• Vidatronic Announces Flexsupply Family of Switched-Capacitor DC-DC Converter IP Cores (Monday Oct. 30, 2017)
  Vidatronic announces the Flexsupply™ Family of Switched-Capacitor Regulated Voltage-Doubler IP Cores in the TSMC 40 nm process. The IP cores are optimized for low-power system-on-a-chip (SoC), application specific integrated circuit (ASIC), and microprocessor integration.
  
  
• NetSpeed and UltraSoC partner to accelerate development time for complex SoCs (Thursday Oct. 26, 2017)
  NetSpeed Systems and UltraSoC announced today that the companies have teamed up to accelerate the time from concept to system validation for complex SoCs. The two companies have integrated their solutions, including UltraSoC monitors, debug ports, and analytics, to work seamlessly with NetSpeed infrastructure.
  
  
• Sonics And Moortec Partner To Provide Temperature-Compensated DVFS Capability For SoC And MCU Designers (Wednesday Oct. 25, 2017)
  Sonics, Inc., the world's foremost supplier of on-chip network (NoC) and power management technologies and services, and Moortec, specialists in embedded in-chip sensing, today announced their partnership that integrates the companies' products to provide advanced power management techniques to system-on-chip (SoC) and MCU designers.
  
  
• New ASIL-B Ready ISO 26262 Certified VESA DSC IP Cores Launched by Hardent (Tuesday Oct. 24, 2017)
  Hardent, a leading expert in VESA Display Stream Compression (DSC) technology, has announced the expansion of its IP portfolio to include new ASIL-B ready ISO 26262 certified IP products for the automotive marke
  
  
• Flex Logix Demonstrates Flexible Microcontroller at Arm TechCon (Tuesday Oct. 24, 2017)
  Highlighting a major advancement in chip design, Flex Logix Technologies, Inc., today announced it is demonstrating the initial version of its flexible microcontroller design concept with embedded FPGA at this week’s Arm TechCon in its booth #201.
  
  
• eMemory Unveils Auto-Grade EEPROM IP with over 500K Cycle Endurance (Tuesday Oct. 24, 2017)
  World-leading silicon IP provider eMemory has expanded its high-endurance NVM (Non-volatile Memory) offerings with an upgraded EEPROM (Electrically-Erasable Programmable Read Only Memory) which supports over 500,000 rewrite cycles and meets the automotive industry’s standards of 10-year data retention at 150°C operation.
  
  
• Andes 32-bit CPU IP Cores Implemented on GLOBALFOUNDRIES 22FDX Process Technology (Tuesday Oct. 24, 2017)
  Andes Technology and GLOBALFOUNDRIES (GF) today jointly announced that Andes’ 32-bit CPU IP cores have been implemented on GF’s 22nm FD-SOI (22FDX®) technology
  
  
• Silvaco Introduces Arm Cortex M0-based I3C Sensor Subsystem (Monday Oct. 23, 2017)
  Silvaco today announced the availability for licensing the industry’s first Arm®-based I3C sensor IP subsystem core. The I3C Sensor Subsystem is an Arm AMBA® based system used to build low power SoCs supporting the new MIPI I3C standard for sensor connectivity.
  
  
• 90% Reduction in power consumption for RFID chips with Dolphin Integration's SESAME eLC standard cell library (Monday Oct. 23, 2017)
  The new generation of SESAME eLC standard-cell library at 180 nm is designed to safely operate near threshold voltage, down to 0.68 V +/- 10%, to provide up to 90% of power savings at 1.3 MHz compared to the sponsored library.
  
  
• Rambus Validates Interoperability of DDR4 High-performance Memory IP Solution for Arm-based Datacenter Systems (Thursday Oct. 19, 2017)
  Rambus today announced the validated interoperability of the Rambus DDR4 PHY and the Arm® CoreLink™ DMC-620 Dynamic Memory Controller. Together, these IP blocks offer speeds of up to 3200 Mbps, the highest performance memory speed available on the market. This partnership provides a verified solution to chip designers, reducing design time and improving time-to-market for demanding datacenter and communications applications.
  
  
• M31 Technology and Corigine have launched the world's first USB-IF certified 28 nm Superspeed+ USB 3.1 Gen 2 IP Solution (Thursday Oct. 19, 2017)
  M31 Technology Corporation, a global Silicon Intellectual Property (IP) boutique, today announced that Corigine’s USB 3.1 Gen 2 PC host and device controller intellectual property (IP) with M31 28nm PHY is certified by the USB Implementers Forum (USB-IF) and compliant with USB SuperSpeed+, the fastest USB speed standard.
  
  
• Allegro DVT Releases a New Generation of Encoder IPs (Wednesday Oct. 18, 2017)
  Allegro DVT, a leader in video compliance streams and video encoding and decoding semiconductor IP solutions, announced today the availability of new encoder IPs. The new AL-E110 encoder IP targets high-end video applications such as digital still cameras, action cameras, camcorders and video surveillance.
  
  
• Corigine Unveils First Certified SuperSpeed+ USB 3.1 Gen 2 IP With M31 28nm PHY (Wednesday Oct. 18, 2017)
  Corigine, Inc. today announced its USB 3.1 Gen 2 PC host and device controller intellectual property (IP) is certified by the Universal Serial Bus Implementers Forum (USB-IF) and compliant with USB SuperSpeed+, the fastest USB speed standard.
  
  
• Mixel's MIPI C-PHY/D-PHY Combo IP is Silicon-Proven in Multiple Nodes (Tuesday Oct. 17, 2017)
  Mixel announced today that its MIPI® C-PHYSM/MIPI D-PHYSM combo IP is silicon-proven in both 40nm and 55nm process nodes and is going into high-volume production in its customer’s products. The IP is also available in 28nm. The MIPI C-PHY/MIPI D-PHY combo supports the MIPI Camera Serial Interface (CSISM) and MIPI Display Serial Interface (DSISM).
  
  
• Achronix Speedcore Custom Blocks Supercharge Data Acceleration Systems (Tuesday Oct. 17, 2017)
  Achronix today announced the availability of Speedcore custom blocks for its eFPGA IP solutions. Achronix Speedcore eFPGAs accelerate data intensive AI / machine learning, 5G wireless, automotive ADAS, datacenter and networking applications.
  
  
• Rambus Delivers High-Speed SerDes Interface Solutions on GLOBALFOUNDRIES FX-14 ASIC Platform for Data Center and Enterprise (Thursday Oct. 12, 2017)
  Rambus today announced the availability of a suite of silicon-proven, high-speed SerDes solutions including 16G MPSL (multi-protocol serial link), 30G C2C (chip-to-chip) and 30G VSR (very short reach) PHYs developed for GLOBALFOUNDRIES high-performance FX-14™ ASIC platform.
  
  
• Mobiveil Announces 25xN RapidIO Specification 4.1 (25G) Digital Controller IP for Next-Generation Wireless Networking, High-Performance Computing Applications (Wednesday Oct. 11, 2017)
  Mobiveil, Inc., a fast-growing supplier of silicon intellectual property (IP), platforms and IP-enabled design services, today announced availability of its digital controller IP compliant with the 25xN RapidIO® Specification 4.1.
  
  
• ACTT's Complete IoT Solution Now Available on SMIC 55nm eFlash Platform (Tuesday Oct. 10, 2017)
  Semiconductor Manufacturing International Corporation ("SMIC"; NYSE: SMI; SEHK: 981), one of the leading semiconductor foundries in the world and the largest and most advanced foundry in mainland China, and Chengdu Analog Circuit Technology Inc. (ACTT), a leading Analog IP provider, today jointly announced the availability of ACTT's Analog IP solution on SMIC's 55nm eFlash technology.
  
  
• Near zero power consumption for RFID chips with Dolphin Integration's SESAME eLC standard cell library (Monday Oct. 09, 2017)
  For RFID Tags, dynamic power consumption is a critical performance as the capability to lower power translates into a wider range of detection (RFID tag read range) and a highest identification rate in the same range.
  
  
• SoC-e releases Multiport Time Sensitive Networking (TSN) IP Core (Monday Oct. 09, 2017)
  SoC-e’s TSN solution is called Multiport TSN Switch (MTSN) IP. This IP has been designed to be implemented on Programmable SoCs. As an example, targeted devices are the Xilinx Zynq-7000 all programmable SoC and Zynq Ultrascale+ MPSoC.
  
  
• NetSpeed's Turing Brings Machine Learning to SoC Design (Thursday Oct. 05, 2017)
  NetSpeed Systems Inc., announced today the release of Turing, a solution for optimizing SoC interconnects that uses supervised learning to explore patterns in interconnect design data to home in on promising strategies quickly.
  
  
• SiFive Launches First RISC-V Based CPU Core with Linux Support (Wednesday Oct. 04, 2017)
  SiFive announced the availability of U54-MC Coreplex IP, the industry's first RISC-V based, 64-bit, quadcore real-time capable application processor with support for full featured operating systems such as Linux.
  
  
• ArterisIP announces Ncore 3 Cache Coherent Interconnect (Wednesday Oct. 04, 2017)
  ArterisIP today announced the Ncore Cache Coherent Interconnect IP version 3 along with the optional Ncore Resilience Package for functional safety.
  
  
• Mn_nH release stereo 3D 360 stitching IP solution for high-end 3D VR camera (Wednesday Sep. 27, 2017)
  Nowadays 360 degree image is widely used for not only HMD but also web image, action cam and special place promotions. A step further, several IoT applications like as drone, ADAS, robot, military and boring camera try to adopt 360 degree image to enhance convenience and record surround image included more informations.
  
  
• Alizem Releases its New 3-phase PWM IP Core for Intel MAX 10 FPGAs (Monday Sep. 25, 2017)
  Alizem today announced the release of its new 3-phase PWM IP Core optimized for Intel® MAX® 10 FPGAs and designed to be used in 3-phase inverter power electronics applications such as industrial pump control, solar power conversion and power supplies.
  
  
• Imagination reveals PowerVR Neural Network Accelerator (NNA) with 2x the performance and half the bandwidth of nearest competitor (Thursday Sep. 21, 2017)
  Imagination Technologies (IMG.L) reveals its complete, standalone hardware IP neural network accelerator, with industry-leading area efficiency delivered by a specialized PowerVR architecture implementation for neural networks (NNs).
  
  
• Imagination's new PowerVR GPUs enable chip companies and OEMs to create the best possible user experience in cost-sensitive devices (Thursday Sep. 21, 2017)
  Imagination Technologies announces a new generation of PowerVR GPUs that raises the bar on graphics and compute in cost-sensitive devices, letting SoC vendors achieve a significant boost in performance with no impact on silicon area versus previous generation GPUs.