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IP / SOC Products News

• Microsemi Announces LiteFast Serial Communication Protocol to Reduce Customers' Design-In Efforts and Time to Market (Tuesday Aug. 30, 2016)
  Microsemi today announced the availability of its new LiteFast solution, a proprietary lightweight, high-speed, low latency, point-to-point serial communication protocol. Embedded systems across a wide variety of applications use high-speed serial interface and protocols to transfer data at speeds higher than 1 gigabit per second (Gbps).
  
  
• Flex Logix Reconfigurable, Low-Power IP Cores Now Available for TSMC 40ULP (Monday Aug. 29, 2016)
  Now in fabrication and expected to be fully validated in silicon during Q4 2016, the EFLX IP Core family for TSMC 40ULP will enable customers to design their next-generation MCUs and SoCs with reconfigurable RTL that can be quickly, easily and cost-effectively updated or changed at any time after fabrication, even in-system
  
  
• eMemory Unveils EcoBit Technology for RFID and NFC Applications (Monday Aug. 29, 2016)
  eMemory today unveils its ultra-low power embedded logic MTP solution, EcoBit technology, aimed at the market for passive Radio Frequency Identification (RFID) and Near Field Communication (NFC). With ultra-low voltage domain and excellent operating current management, EcoBit IP is ideal for RFID or NFC IC designs operating under strict power constraints.
  
  
• Sidense Demonstrates Successful 1T-OTP Operation in TSMC 16nm FinFET Process (Tuesday Aug. 23, 2016)
  Sidense today announced that it has demonstrated successful operation of its patented SHF 1T-OTP memory macros at TSMC’s 16FF+ and 16FFC process nodes.
  
  
• Dolphin Integration unveils a Smart Modulator for lowest power-consumption of digital microphones (Monday Aug. 22, 2016)
  Dolphin Integration, the mainstream provider of delta-sigma converters for audio applications, unveils the first silicon IP – mMOD67.5-ROOSTER-VD.01 – targeting green microphones which combines an ultra-low power voice activity detector (WhisperTrigger-a) with an ultra-low power ADC modulator.
  
  
• Arasan Announces MIPI DPHY IP Core for TSMC 40uLP Process Targeting IoT (Monday Aug. 15, 2016)
  Arasan Chip Systems a leading provider of semiconductor IP for mobile and automobile SoCs today announced the availability of its MIPI DPHY IP Core for TSMC’s latest TSMC 40uLP process supporting 0.9v & 1.1v.
  
  
• IP-Maker to showcase OLTP SQL acceleration (Thursday Aug. 11, 2016)
  IP-Maker, the NVMe expert startup, showcased its new SQL acceleration demo at Flash Memory Summit, reaching 200k+ transactions per minutes (TPM) on a low cost server, leading in a very efficient performance/cost/power consumption configuration.
  
  
• Arastu Systems announces highly flexible and compact DDR3/4 single controller (Friday Aug. 05, 2016)
  Systems, a company that specializes in developing IPs in the Memory and Networking area today announced the immediate availability of an optimized DDR3/4 DRAM Controller Core, which gives users the flexibility to choose DRAM memories that fits best into their needs.
  
  
• IntelliProp Announces NVMe Host Accelerator IP Core With User-Friendly Hardware Interface (Friday Aug. 05, 2016)
  IntelliProp announced today the availability of a new, NVMe Host Accelerator IP Core, the IPC-NV164-HI. The NVMe Host Accelerator Core will find primary application with companies doing FPGA and ASIC designs who need connectivity with PCIe based NVMe storage devices.
  
  
• Faraday 12.5G SerDes PHY Debuts on UMC 28HPC(U) Process (Wednesday Aug. 03, 2016)
  Faraday Technology Corporation and UMC today announced the availability of Faraday's 12.5Gbps programmable SerDes PHY IP on UMC's 28HPCU process technology.
  
  
• Cadence Delivers Industry's First Design and Verification IP for MIPI SoundWire v1.1 High Quality Audio Solutions (Tuesday Aug. 02, 2016)
  Cadence Design Systems, Inc. (NASDAQ: CDNS) today announced that they have delivered the industry’s first Design and Verification IP for MIPI SoundWire v1.1 and demonstrated interoperability of MIPI SoundWire solutions in collaboration with Realtek.
  
  
• PLDA and Epostar to Demonstrate New PCIe/NVMe Solution, Delivering the Increased Throughput and Decreased Latency Required for Today's PCIe SSD Storage Applications (Monday Aug. 01, 2016)
  PLDA, the industry leader in PCI Express® interface IP solutions, and Epostar, the industry expert in NVMe applications, today announced a demonstration of an innovative development platform enabling PCIe® and NVMe for storage applications.
  
  
• Hardent Launches New DisplayPort 1.4 Forward Error Correction IP Cores (Friday Jul. 29, 2016)
  Hardent has today announced the availability of new DisplayPort™ 1.4 Forward Error Correction (FEC) encoder and decoder IP cores. These IP products will enable semiconductor and IP vendors to quickly create DisplayPort 1.4-compatible transmitter and receiver interfaces for integration in applications transporting High Dynamic Range (HDR) and 8K video across the DisplayPort interface.
  
  
• Cadence Launches Tensilica Fusion G3 DSP Featuring Exceptional Out-of-the-Box Performance for Compute-Intensive Signal Processing Applications (Wednesday Jul. 27, 2016)
  Cadence Design Systems, Inc. (NASDAQ: CDNS) today announced the availability of the new Cadence® Tensilica® Fusion G3 digital signal processor (DSP), a multi-purpose, high-performance DSP ideal for compute-intensive system-on-chip (SoC) designs.
  
  
• Rambus Announces Silicon-proven R+ DDR4 PHY on GLOBALFOUNDRIES 14nm LPP Process for Networking and Data Center Applications (Wednesday Jul. 27, 2016)
  Rambus Inc. (NASDAQ:RMBS) today announced that it has developed an R+ DDR4 PHY on the GLOBALFOUNDRIES FX-14™ ASIC platform using the company’s most advanced 14nm Power Plus (LPP) process.
  
  
• SST and SilTerra Announce Production Readiness of Embedded SuperFlash Macros on SilTerra's 180 nm CMOS Platform (Tuesday Jul. 26, 2016)
  Microchip Technology Inc. (NASDAQ: MCHP), a leading provider of microcontroller, mixed-signal, analog and Flash-IP solutions, through its Silicon Storage Technology (SST) subsidiary, announced today that silicon-proven SuperFlash® macros are now available on SilTerra’s 180 nm CMOS technology.
  
  
• Kandou's Glasswing IP JEDEC Compliant (Tuesday Jul. 26, 2016)
  Kandou Bus has announced that their Glasswing™ GW28-125-USR interface macro that has been manufactured, tested and characterized, is compliant to the newly published JEDEC specification, JESD247.
  
  
• eMemory Announces Comprehensive NVM Solution in 0.13um BCD Process for PMIC Applications (Tuesday Jul. 26, 2016)
  eMemory announces today that the NeoEE IP, its embedded logic MTP solution, has been verified in 0.13um 1.5V/5V BCD process platform at a world-leading foundry. eMemory’s OTP solution NeoBit was qualified in 2013, which means that both OTP and MTP IPs from eMemory are now available in 0.13um 1.5V/5V BCD process, offering comprehensive NVM IP solutions for power management IC (PMIC) applications.
  
  
• Save up to 20 % of silicon area with Dolphin Integration's standard cell library SESAME uHD (Monday Jul. 25, 2016)
  For integrated circuits with really high volumes, such as MCUs, SESAME uHD (ultra High Density), the flagship product in Dolphin Integration's standard cell library offering, is paramount to decrease die costs.
  
  
• CAST Introduces Low-Power, Ultra-HD Capable Video Compression Cores (Thursday Jul. 21, 2016)
  Semiconductor intellectual property provider CAST, Inc. recently introduced the newest generation in its eighteen-year-long series of IP cores for video and image compression.
  
  
• RFEL Supplies HyperSpeed FFT IP Core to Arizona Radio Observatory (Wednesday Jul. 20, 2016)
  RFEL is supplying one of its HyperSpeed FFT™ IP cores to the Arizona Radio Observatory (ARO) at the University of Arizona in Tucson, Arizona. They are developing a new high performance radio astronomy spectrometer system where RFEL’s core forms a key component to improve sideband separation in their heterodyne receivers.
  
  
• Synopsys Expands DesignWare MIPI IP Portfolio with DSI and CSI-2 Device Controllers (Wednesday Jul. 20, 2016)
  Synopsys today announced the immediate availability of its new DesignWare® MIPI® CSI-2℠ Device Controller IP and DesignWare MIPI DSI℠ Device Controller IP for mobile, automotive and Internet of Things (IoT) system-on-chips (SoCs).
  
  
• CEVA to Unveil its CEVA-X2 DSP at the Linley Mobile & Wearable Conference 2016 (Monday Jul. 18, 2016)
  CEVA today announced that it will unveil the CEVA-X2 DSP targeting multi-RAT PHY control and other advanced modem workloads at the upcoming Linley Mobile & Wearables Conference 2016.
  
  
• The DTPCI32DC - Dual Clock 32bit PCI Bus Target Interface from Digital Core Design (Thursday Jul. 14, 2016)
  Digital Core Design, one of the most experienced (since 1999) IP Core providers and a System-on-Chip design house, introduced to its portfolio the DTPCI32DC. It’s a Dual Clock 32-bit PCI Bus Target Interface IP Core which meets all requirements of the PCI 3.0 specification for a target device. Moreover, it compromises a minimal gate count with a high-bandwidth data transfer.
  
  
• Synopsys' New USB 2.0 Type-C IP Cuts Power and Area for IoT Edge Applications (Wednesday Jul. 13, 2016)
  Synopsys, Inc. (Nasdaq:SNPS) today announced it has reduced the power and area of its DesignWare® USB 2.0 Type-C Controller and PHY IP for cost-sensitive and energy-efficient Internet of Things (IoT) edge applications targeting 40-nanometer (nm) and 55-nm ultra-low power processes.
  
  
• LETI Develops 3D Network-on-Chip to Improve High-Performance Computing (Wednesday Jul. 13, 2016)
  Leti, a CEA Tech institute, today announced it has developed a new on-chip communications system to improve high-performance computing (HPC) that is faster and more energy efficient than current solutions and is compatible with 3D architectures.
  
  
• eMemory's NeoEE Solution Facilitates Module Integration for Fingerprint Applications (Wednesday Jul. 13, 2016)
  eMemory announces today that in addition to offering NeoBit IP to enhance fingerprint ICs security, its NeoEE solution for fingerprint applications has also been embedded in customer products for volume production. NeoEE IP, an embedded logic multiple-time programmable (MTP) solution, is an excellent replacement for the portable EEPROM IC and further facilitates fingerprint module integration.
  
  
• SST Announces Qualification of Embedded SuperFlash on GLOBALFOUNDRIES' BCDLite Process (Tuesday Jul. 12, 2016)
  Microchip Technology Inc. (NASDAQ: MCHP), a leading provider of microcontroller, mixed-signal, analog and Flash-IP solutions, through its Silicon Storage Technology (SST) subsidiary, announced today qualification and availability of SST's low-mask-count embedded SuperFlash® non-volatile memory (NVM) on GLOBALFOUNDRIES' 130 nm BCDLite® technology platform.
  
  
• IP-Maker to release NVMe PCIe Gen 3 reference design (Tuesday Jul. 12, 2016)
  IP-Maker, the French startup specialized in high performance storage technologies, released its new NVMe Express (NVMe) reference design, using a PCIe Gen3 interface. It is based on the low latency hardware NVMe engine designed by IP-Maker.
  
  
• Chips&Media launches 2nd generation High Performance Google's VP9 and HEVC Multi-format Decoder IP (Monday Jul. 11, 2016)
  Chips&Media Inc. announced today they completed development of 2nd generation VP9 and HEVC(H.265) multi-format Decoder IP - WAVE512 and now are available to customers. This is the second rollout of their high-performance UHD (4K/8K) Video IP series called WAVE5 which are based on the sophisticated new architecture.