Apr. 24, 2019 - Synopsys, Inc. today announced that the Synopsys Design Platform has been certified for TSMC's latest System-on-Integrated-Chips (TSMC-SoIC™) 3D chip stacking technology.

Apr. 24, 2019 - Full suite of Cadence digital and signoff, custom/analog, and IC package and PCB analysis tools optimized for TSMC SoIC chip stacking technology

Apr. 22, 2019 - Cadence Design Systems, Inc. (NASDAQ: CDNS) today announced that it has collaborated with TSMC to enable customers’ production delivery of next-generation system-on-chip (SoC) designs for mobile, high-performance computing (HPC), 5G and artificial intelligence (AI) applications on TSMC’s 5nm FinFET ...

Apr. 22, 2019 - Synopsys, Inc. (Nasdaq: SNPS) today announced that Desay SV has adopted its Virtualizer™ virtual prototyping solution to accelerate software development of next-generation automotive systems.

Apr. 18, 2019 - The program focuses on delivering Synopsys Virtualizer™ Development Kits (VDKs) for the ST Stellar family of automotive multicore microcontrollers (MCUs), enabling companies to accelerate the development of automotive electronic systems by enabling the move from physical to virtual testing.

Apr. 16, 2019 - Samsung Electronics today announced that its 5-nanometer (nm) FinFET process technology is complete in its development and now is ready for customers’ samples. By adding another cutting-edge node to its extreme ultraviolet (EUV)-based process offerings, Samsung is proving once again its leadership ...

Apr. 03, 2019 - TSMC today announced delivery of the complete version of its 5 nanometer (nm) design infrastructure within the Open Innovation Platform® (OIP). This full release enables 5nm systems-on-chip (SoC) designs in next-generation advanced mobile and high-performance computing (HPC) applications, targeting ...

Apr. 01, 2019 - Cadence Design Systems, Inc. (NASDAQ: CDNS) today announced that the Cadence® Innovus™ Implementation System and Quantus™ Extraction Solution are now enabled for the Samsung Foundry Gate-All-Around (GAA) technology.

Mar. 28, 2019 - Cadence today announced that it is working with Northrop Grumman on advanced-node system-on-chip (SoC) projects, enabling the delivery of high-quality, high-performance SoCs. Cadence® system and verification, digital and signoff, custom/analog and packaging tools, as well as IP solutions, have supported ...

Mar. 14, 2019 - Synopsys today announced that Renesas Electronics Corporation has deployed Synopsys' Fusion Compiler™ RTL-to-GDSII implementation solution for its high-performance automotive system-on-chips (SoCs) and mission-critical microcontrollers (MCUs) to accelerate broad market access to next-generation automotive ...

Feb. 19, 2019 - GLOBALFOUNDRIES (GF) and Dolphin Integration, a leading provider of semiconductor IP, today announced a collaboration to develop a series of adaptive body bias (ABB) solutions to improve the energy efficiency and reliability of system-on-chip (SoC) on GF’s 22nm FD-SOI (22FDX®) process technology ...

Jan. 23, 2019 - Inomize, a world leader of ASIC design services was selected by HP Indigo to develop an ASIC solution for their next generation of high-resolution industrial presses.

Dec. 10, 2018 - Synopsys, Inc. (Nasdaq: SNPS) announced today another milestone in its longstanding partnership with imec, a world-leading research and innovation hub in nanoelectronics and digital technologies, with the successful completion of the first comprehensive sub-3 nanometer (nm) parasitic variation modeling ...

Dec. 03, 2018 - Imperas Software Ltd., the leader in virtual platforms and high-performance software simulation, today announced the partnership with Valtrix Systems for advanced RISC-V Processor test and validation.

Nov. 20, 2018 - Xilinx, Inc. (NASDAQ: XLNX) today announced that its Zynq® UltraScale+™ MPSoC family has been assessed as SIL 3, HFT1 capable, according the IEC 61508 functional-safety specification, by Exida, the leading functional safety certification agency.

Oct. 29, 2018 - Kazan Networks today announced the release of its Fuji NVMe-oF™ Bridge ASIC to volume production in December 2018, along with its companion Onyx Bridge Adapter.

Oct. 09, 2018 - Mentor, a Siemens business, today announced it has qualified complete solutions from its Calibre® nmPlatform™, Analog FastSPICE™ (AFS)™ Platform, Eldo® Platform and Nitro-SoC place and route system for GLOBALFOUNDRIES' 22FDX Fully-Depleted Silicon-On-Insulator (FD-SOI) integrated circuit (IC) ...

Oct. 04, 2018 - Synopsys, Inc. (Nasdaq: SNPS) today announced the Synopsys Design Platform fully supports TSMC's wafer-on-wafer (WoW) direct stacking and chip-on-wafer-on-substrate (CoWoS®) advanced packaging technologies.

Oct. 02, 2018 - Cadence Design Systems, Inc. (NASDAQ: CDNS) today announced that its digital tools and advanced IC packaging solutions support the new TSMC InFO_MS (InFO with Memory on Substrate) packaging technology.

Oct. 01, 2018 - Open-Silicon, a system-optimized ASIC solution provider and long-standing member of TSMC’s Value Chain Aggregator (VCA) and Design Center Alliance (DCA) programs, will present on custom SoC platform solutions for AI applications at the TSMC Open Innovation Platform® (OIP) Ecosystem Forum on October ...

Oct. 01, 2018 - Cadence today announced its continued collaboration with TSMC to certify its design solutions for TSMC 5nm and 7nm+ FinFET process technologies for mobile and high-performance computing (HPC) designs.

Sep. 10, 2018 - BrainChip, the leading neuromorphic computing company, today establishes itself as the first company to bring a production spiking neural network architecture – the Akida Neuromorphic System-on-Chip (NSoC) – to market.

Aug. 27, 2018 - Synopsys today announced a state-of-the-art artificial intelligence (AI) enabled formal verification app, Regression Mode Accelerator, as part of the Synopsys VC Formal® solution.

Aug. 14, 2018 - Antmicro, a software-driven technology vendor for edge AI and cyber-physical systems, and SiFive, the first fabless semiconductor company to offer customized silicon based on the free and open RISC-V Instruction Set Architecture, are announcing a milestone partnership to bring forth a complete offering ...

Aug. 14, 2018 - By combining the Palladium Z1 emulation platform with Cadence Xcelium™ Parallel Logic Simulation, GUC engineers were able to apply more complex SoC verification test scenarios with full debug visibility, accelerating verification by up to 795 times.

Jul. 31, 2018 - Thalia Design Automation and Catena, a leader in radio frequency (RF) communication intellectual property (IP) for connectivity, today announced successful completion of their first jointly delivered analog IP reuse projects.

Jul. 25, 2018 - The Akida Development Environment is a machine learning framework for the creation, training, and testing of spiking neural networks (SNNs), supporting the development of systems for edge and enterprise products on the Company’s Akida Neuromorphic System-on-Chip (NSoC).

Jun. 18, 2018 - On June 13-14th, 2018, Dolphin Integration, partner of the ENIAC’s THINGS2DO European project, showcased its achievements with PowerStudio, its cutting-edge EDA tool for safe Power Regulation Networks implementation.

Jun. 14, 2018 - Synopsys, Inc. (Nasdaq: SNPS) today announced that Samsung Foundry has certified the Synopsys Design Platform with Fusion Technology for 7-nanometer (nm) Low Power Plus (LPP) process with Extreme Ultraviolet (EUV) lithography technology.

Jun. 06, 2018 - Sonics announced a partnership with Synkom, a leading electronic design services firm in Japan, that incorporates NoC and Energy Processing Unit (EPU) IP into Synkom’s design flow for companies creating complex chips using Synkom’s services.

May. 23, 2018 - Synopsys today announced that Samsung Electronics Co., Ltd., a world leader in advanced semiconductor technology, has certified the Synopsys Design Platform for Samsung Foundry's 8-nanometer (nm) LPP (Low Power Plus) process.

May. 01, 2018 - Cadence today announced that its full suite of Cadence® digital, signoff and custom/analog IC design tools, along with advanced IC packaging design solutions, support the new TSMC Wafer-on-Wafer (WoW) stacking technology.

May. 01, 2018 - Cadence today announced its continued collaboration with TSMC to further 5nm and 7nm+ FinFET design innovation for mobile and high-performance computing (HPC) platforms.

Apr. 16, 2018 - Arm and Synopsys, Inc. (Nasdaq: SNPS) have extended their collaboration and signed a multi-year subscription agreement expanding Synopsys' access to a broad range of Arm intellectual property (IP) to enable optimization of Synopsys tools and methodologies for Arm-based system-on-chips (SoCs).

Apr. 11, 2018 - Cadence Design Systems, Inc. (NASDAQ: CDNS) today introduced major enhancements to its Cadence® Virtuoso® custom IC design platform that improve electronic system and IC design productivity.

Mar. 06, 2018 - Silvaco today announced that it has acquired NanGate, a leader in Electronic Design Automation (EDA) software, that offers tools and services for creation, optimization, characterization and validation of physical library IP.

Mar. 01, 2018 - CEVA today announced that it is supporting Nokia in the development of its ReefShark baseband System-on-Chips (SoCs), set to be deployed for 4.9G and 5G wireless infrastructure.

Feb. 27, 2018 - Sonics announced a partnership with Inomize (Netanya, Israel) that enables chip designs to comply with the ISO 26262 automotive functional safety standard using Sonics’ NoCs with Inomize’s ASIC design platforms and services.

Feb. 26, 2018 - Together, Magillem and Imperas provide a unique virtual prototyping solution set, fully based on the IEEE standards IP-XACT and SystemC.

Feb. 08, 2018 - Siemens today announced it has entered into an agreement to acquire Oulu, Finland-based Sarokal Test Systems Oy, a provider of innovative test solutions for fronthaul networks that are comprised of links between the centralized radio controllers and the radio heads (or masts) at the "edge" of a cellular ...