I3C Prototyping Kit (HDK) Total IP in a Box
SuperSpeed USB 3.1 Dual-Role Device Controller
5G NR IP Platform for Smartphones and Broadband Connected Devices
Single- and double-precision IEEE-754 floating-point unit
Rambus Acquires Memory Technology Assets of Diablo Technologies
Xilinx Technology to Power Baidu Brain Edge AI Applications
Arteris IP FlexNoC Interconnect Licensed by Baidu for Kunlun AI Cloud Chips for Data Center
Secure SOC for Security Aware Applications
Bulletproofing PCIe-based SoCs with Advanced Reliability, Availability, Serviceability (RAS) Mechanisms
Extending 8K over a single, cost-effective wire with TICO lightweight compression
Tensilica at CES
Designing a custom SoC: 9 next steps after downloading your Arm IP
Disturbances in the AI Force
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