Latest News

Today on Design-Reuse.com

RaaS, a collaborative initiative, adopted Menta's eFPGA technology for RaaS Edge Computing ...

Menta has delivered its best technology to the Research Association for Advanced Systems (RaaS). Read

Cadence Tensilica HiFi 5 DSPs Used in NXP's Next-Gen Audio DSP Family

In a significant achievement for the automotive industry, Cadence's Tensilica HiFi 5 Digital Signal Processors (DSPs) are now a key component in NXP® ... Read

SiFive Highlights Key Inflection Points Driving RISC-V Adoption for AI and Introduces Intelligence ...

This is the first IP from SiFive to include a highly scalable AI matrix engine, which accelerates time to market for semiconductor companies building ... Read

Intel and AWS Expand Strategic Collaboration, Helping Advance U.S.-Based Chip Manufacturing ...

Intel to Produce Custom AI Fabric Chip on Intel 18A and Custom Xeon 6 Chip on Intel 3 for AWS; Multi-Year, Multi-Billion-Dollar Collaboration Accelerates ... Read

Joachim Kunkel Joins Arteris Board of Directors

Arteris, Inc. (Nasdaq: AIP), a leading provider of system IP which accelerates system-on-chip (SoC) creation, today announced that Joachim Kunkel will ... Read

Omni Design Technologies Partners with Aura Intelligent Systems on Next Generation Radar

Under the partnership agreement, Omni Design is providing custom, advanced Swift™ data converters, analog front-end (AFE), and supporting IP solutions. ... Read

Industry Expert Blogs

arasan-i3c-phy-ternary-vs-non-ternaryArasan Blog
accelerating-risc-v-processor-verification-a-co-simulation-strategyFrontgrade Gaisler Blog
Fabio Malatesta, Frontgrade Gaisler
3-steps-to-shrinking-your-code-size-your-costs-and-your-power-consumptionCodasip Blog
Tariq Kurd, Distinguished Engineer and Lead IP Architect, Codasip
deep-learning-imaging-vision-iot-hearables-featuring-aiCeva's Experts blog
Elia Shenberger, Ceva

New Products


Join us on October 1st for Rambus Design Summit, where we’ll dive into the technology needed to power generative AI, from memory and high-speed interconnects, to hardware-level security.
When: October 1st, 2024

Register Today >>

Bluetooth® V6.0 Channel Sounding
Redefining Wireless Performance
  • BT & BLE RF Transceiver IP Silicon Proven in 22nm & 40nm
  • Enables High-Accuracy, low latency with great performance
  • Bluetooth LinkLayer Controller, SW Stack & Profiles
  • IP licensed for a leading Automotive SOC

  • Leverage SiliconMAX HSAT & Synopsys TestMAX
  • Create timing margin heat map for functional paths in an SoC
  • Achieve better PPA by leveraging silicon model calibration
  • Provides key input for AVFS/AVS based optimization schemes

  • Delivered as hard macro with I/Os to exact customer floorplan
  • Easy to close timing, integrate and test
  • Available in variety of protocols and TSMC processes

Partner with us




List your Products

Suppliers, list your IPs for free.