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Monday, August 10, 2026

• AI Chip Design Era Ends: TSMC Affiliate GUC Posts Record Revenue as Turnkey Surpasses 80%
• After Seven CEOs in 10 Years, Imagination Is Sticking to Its Strategy
• Arm delivers record first-quarter for total revenue
• Chips&Media Nears Selection of M&A Target Worth Up to 100 Billion Won
• Silvaco Reports Second Quarter 2026 Financial Results
• SkyeChip Well Positioned To Capitalise On Global AI Semiconductor Growth
• Xiphera Achieves ISO/IEC 27001:2022 Certification
• "RISC-V and Open Source are India’s Golden Moment to Become Relevant in Semiconductor Product Design Innovation" – Sharat Kaul, Global Design, Advanced Packaging and OSAT Advisor
• Cadence Develops Agentic AI Platform for PCB Design
• Cadence certifies AI-driven reference flows for Intel 18A-P and Intel 14A
• Samsung Foundry's 4nm production fully booked through next year
• TSMC Accelerates 3nm Output Months Early; 1.4nm Factory Beats Schedule
• Silicon-Proven D2D Interconnect IP Cores for High-Speed, Scalable Chiplet Connectivity

Thursday, August 6, 2026

• Arteris Appoints Saurabh Sinha as Chief Financial Officer
• GUC Monthly Sales Report in July 2026
• GlobalFoundries Reports Second Quarter 2026 Financial Results
• Samsung Unveils Next-Gen 3D-Memory Vision at FMS 2026, Charting the Future of AI Infrastructure
• Spain’s semiconductor ambitions gather momentum through regional collaboration and European alignment
• QuickLogic to Report Second Quarter 2026 Financial Results on Tuesday, August 11 and Participate in Key Investor Conferences in the Third Quarter
• Rambus Initiates $100 Million Accelerated Share Repurchase Program
• Automotive Cybersecurity: AI Attack Surfaces Grow
• EnSilica joins European consortium developing 5G satellite user terminals for IRIS network
• BTQ Technologies and ICTK Complete Design of Next-Generation QCIM Security Chip Integrating PUF Technology
• Accelerating AI-Powered Wearable Device Development with a Reusable Blueprint
• Ceva and Actions Technology Collaborate to Bring Bluetooth HDT Audio Chips to Market
• Tenstorrent Sets New Performance Records, Launches TT- Ascalon S, and Expands Across Japan
• Andes Technology Unveils Next-Generation AI Solutions: AndesAIRE™ AnDLA™ I370 v2.0 and NN SDK v1.2.0 for Advanced ViT, VLM, and SLM at the Edge
• Innosilicon’s LPDDR6 Memory IP Lands at Major Korean DRAM Maker, as It Unveils GDDR7, HBM4, & PCIe 6.0 Technologies Spanning 28nm to 3nm
• Rambus Serves Up DDR5 RDIMM Server Chipset for Next-Gen AI Data Centers
• Samsung foundry targets full capacity utilization in second half of 2026

Wednesday, August 5, 2026

• The Zigbee Transceiver PHY IP Core is Available for Licensing and Integration from Global IP Core

Tuesday, August 4, 2026

• Dnotitia’s Seahorse AI Storage Wins AI Application Award at FMS 2026

Monday, August 3, 2026

• Arm Holdings plc reports results for the first quarter of the fiscal year ending 2027
• SEMI reports 7.4% rise in silicon wafer shipments
• Marvell commits $250m to India expansion as AI and semiconductor development accelerates
• Cyber Resilience Act, Part 2: Security by Design becomes mandatory
• Engineering Matter-ready Home Automation Solutions with Reusable Blueprints
• Radiation-Hardened by Design: Building Interfaces for Space and Nuclear on TSMC CMOS
• Wi-Fi 7 & Wi-Fi 6 RF Transceiver IP Portfolio Expanded by T2M for Next-Generation Wireless SoCs
• Advancing Europe’s Automotive Innovation Ecosystem: Arteris Continues Its Work in the RIGOLETTO Project
• From Trust to Action: Building the Foundations of Trustworthy, Physical AI
• Making Neuromorphic Edge AI Design-Ready with Verified ECAD Models
• Researchers Explore Next-Generation AI Architectures Using Weebit ReRAM
• Stealthium and Tenstorrent Partner to Deliver Runtime Observability for AI Infrastructure
• Weebit Nano expands licensing agreements with key customers; three customer chip designs taped-out to-date
• Making chiplets work for AI requires more than connectivity
• Multi-Die, Multiphysics, and the New Rules of Chip Design
• Intel’s U.S. Advanced Packaging Enables Next-Generation AI Semiconductors
• TSMC Moves Up 1.4nm Mass Production to 2028, Intensifying Rivalry With Samsung