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• ElectraIC Launches the NEXUS N1 Series: A New Family of NVIDIA Jetson-Based AI Mini Supercomputers (Tuesday, October 13, 2026)
• T2M-IP Brings Greater Design Freedom to Semiconductor IP with WhiteBox Licensing (Monday, October 12, 2026)
• Cadence Announces Third Quarter 2026 Financial Results Webcast (Thursday, October 8, 2026)
• QuickLogic Announces Inducement Grant Under Nasdaq Listing Rule 5635(c)(4) (Thursday, October 8, 2026)
• JEDEC® Publishes First Industry-Wide Silicon Photonics Reliability Standard for AI, Datacenter and Telecom Infrastructure (Monday, October 5, 2026)
• Nordic Rolls Out New Multiprotocol SoC for Size- and Cost-Effective IoT (Monday, October 5, 2026)
• CEA-Leti and Quobly Strengthen Their Collaboration to Accelerate the Development of Next-Generation Silicon Quantum Technologies (Monday, October 5, 2026)
• Fraunhofer IPMS hosts workshop on scaling quantum chip production (Thursday, October 1, 2026)
• Qualcomm Says Announced 2nm Chips Will Use TSMC, Keeps Door Open to Samsung Foundry (Monday, September 28, 2026)
• From stars to atoms: CSEM and Neuchâtel’s continuing quest for precise time (Monday, September 28, 2026)
• Keysight Enables UC Berkeley Research to Advance 6G Over-the-Air Testing (Monday, September 28, 2026)
• Keysight Expands NR-NTN Validation Coverage Following GCF CAG #87 (Thursday, September 24, 2026)
• Renesas Launches 64-bit RZ/G3L and RZ/G3SE MPUs for Advanced HMI and IoT Edge Systems (Monday, September 14, 2026)
• SEMI urges broader Chips Act 2.0 to boost Europe’s chip competitiveness (Thursday, September 10, 2026)
• BOS Semiconductors CEO Featured in Open Chiplet Atlas Community Voice (Thursday, September 10, 2026)
• QuantalRF Samples DPD-Efficient Linear Wi-Fi 7 and Wi-Fi 8 FEM with Up to 3dB More Mask-Compliant Power at 160 and 320 MHz (Thursday, September 10, 2026)
• Imec scales NbTiN superconducting circuits to 30nm (Thursday, September 10, 2026)
• Silicon-Proven PCIe Gen 5 IP Core Accelerates the Future of High-Performance SoC Connectivity (Monday, August 31, 2026)
• Photonic integrated circuits: the next frontier of advanced optoelectronic devices (Monday, August 31, 2026)
• SEALSQ Subsidiary IC’Alps Advances QASIC Roadmap for Custom Quantum-Resistant ASICs (Monday, August 31, 2026)
• NVMe 2.4 Update Adds Post-Quantum Security, Power Controls (Monday, August 31, 2026)
• Integrated Photonics for Wireless Applications: Enabling Free-Space Optics, 6G, and Beyond (Thursday, August 27, 2026)
• STMicroelectronics and NUS launch Corporate Lab to power the future of Edge AI in Singapore (Wednesday, August 26, 2026)
• Intel Outlines Architectures for Agentic AI at Hot Chips 2026 (Wednesday, August 26, 2026)
• Photonic chip market to hit $9.3bn (Wednesday, August 26, 2026)
• Industry coalition announces Open Silicon Photonics Initiative within Open Compute Project (Monday, August 17, 2026)
• Nordic certification milestone aims to accelerate satellite IoT deployment (Thursday, August 13, 2026)
• Poland in the European semiconductor ecosystem (Wednesday, August 12, 2026)
• TSMC Earnings Jump 77%, Capex Hits $64B [2026] (Wednesday, August 12, 2026)
• AI Chip Demand Is Driving ASML Stock And 2 Semiconductor Picks (Wednesday, August 12, 2026)
• Global semiconductor market tops $1.5 trillion for the first time, full interpretation of SIA's latest report (Thursday, July 30, 2026)
• The Performance Boost for AI: Quantum Computing-Based Methods Make Training of Large Data Models More Efficient (Thursday, July 30, 2026)
• From Co-Packaged Optics to Nanolasers: Photonics Moves Inward (Thursday, July 30, 2026)
• Scalable Network Interconnect IP Core Addresses Growing On-Chip Communication Challenges in Next-Generation SoCs (Monday, July 27, 2026)
• Vietnam, Japan launch five joint semiconductor research projects (Monday, July 27, 2026)
• Lee outlines plan to transform Korea into pillar of global AI supply chain (Saturday, July 25, 2026)
• Can India become the next semiconductor hub after Taiwan? (Friday, July 24, 2026)
• True Circuits Announces the JSPICE™ Design Environment (JDE™) will be Offered Open Source at the Design Automation Conference (Friday, July 24, 2026)
• Arteris to Announce Financial Results for the Second Quarter 2026 on Thursday, August 6, 2026 (Thursday, July 23, 2026)
• EnSilica secures €1.1 million satellite chip orders as beamformer demand grows (LSE:ENSI) (Thursday, July 23, 2026)
• CEA-Leti Looks Beyond SRAM and DRAM as AI Reshapes the Memory Roadmap (Thursday, July 23, 2026)
• RISC-V CPU IP Core - TAE500 -- Accelerate Automotive SoC Development with Functional Safety-Ready Solutions (Monday, July 20, 2026)
• Alphacore excited to exhibit at IEEE Nuclear & Space Radiation Effects Conference (NSREC 2026) in San Juan, Puerto Rico (Monday, July 20, 2026)
• New JEDEC® SPHBM4 Standard Enables HBM4-Class Bandwidth on Organic Substrates (Thursday, July 16, 2026)
• 12FFC MIPI A-PHY Tx/Rx IP for Next-Gen Automotive SoCs (Monday, July 13, 2026)
• Samsung Electronics Delays Mass Production of CXL 3.1 Memory Modules (Thursday, July 9, 2026)
• Discuss Silicon-Ready UCIe IP at DAC 2026, Long Beach, California (Tuesday, July 7, 2026)
• Rambus Targets AI PCs With 9,600 MT/s Client Memory Chipset (Monday, July 6, 2026)
• Samsung Unveils First UFS 5.0 Optimized for on-Device AI (Thursday, June 25, 2026)
• Korea to Invest 800.2 Billion Won in 10 Homegrown AI Chips (Wednesday, June 24, 2026)