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• Siemens and Infineon leverage silicon carbide technology to advance electrical protection in data centers and factories (Thursday, June 11, 2026)
• Meet T2M at MWC Shanghai 24th – 26th Jun’26: Showcasing Next-Generation IP Cores (Monday, June 8, 2026)
• Viettel launches 2026 technology talent program (Monday, June 8, 2026)
• Global Semiconductor Sales Increase 11% Month-to-Month in April (Monday, June 8, 2026)
• The AI-driven semiconductor supercycle accelerates (Monday, June 8, 2026)
• Keysight Expands Photonics Design Ecosystem with GlobalFoundries PDK (Thursday, June 4, 2026)
• Samsung Electronics Begins Shipment of Industry-First HBM4E Samples (Thursday, June 4, 2026)
• FortifyIQ Appoints Avishay Shraga as Chief Product Officer (Monday, June 1, 2026)
• Quanta Computer selects Siemens Xcelerator to advance manufacturing innovation (Thursday, May 28, 2026)
• MIPI Alliance Launches Compliance Program to Strengthen A-PHY Automotive Ecosystem (Thursday, May 28, 2026)
• STMicroelectronics’ new GaN semiconductors improve energy efficiency for high-demand applications from AI servers to robotics (Thursday, May 28, 2026)
• U.S. Quantum Bet Puts Hardware First, But Utility Remains the Test (Monday, May 25, 2026)
• World first: imec presents quantum dot qubit device using High NA EUV lithography (Monday, May 25, 2026)
• ST and quantum: bringing industrial scale to a new compute frontier (Monday, May 25, 2026)
• GlobalFoundries launches Quantum Technology Solutions to scale U.S. quantum manufacturing (Monday, May 25, 2026)
• Webcast: Accelerating Data: Lossless Compression for HPC, Datacenter, AI, and Scientific Data Pipelines (Thursday, May 21, 2026)
• CEA-Leti Publishes Its 2026 Scientific Report Highlighting Breakthroughs in Semiconductor Technologies (Thursday, May 21, 2026)
• SEMIFIVE and ICY Tech Achieve Successful Tape-out of 8nm eMRAM-Based Edge AI SoC, Targeting First Commercialization in Asia (Monday, May 11, 2026)
• AI drives photonics innovation (Thursday, May 7, 2026)
• European scientists turn to light to halt internet energy crisis (Thursday, May 7, 2026)
• Keysight Expands PCIe® 7.0 Test Portfolio with New Receiver Stress Calibration (Thursday, May 7, 2026)
• A lunar network project powered by digital twins (Thursday, April 30, 2026)
• EU unlocks €63M to accelerate AI in health and safety (Thursday, April 23, 2026)
• JEDEC® Previews LPDDR6 Roadmap Expanding LPDDR into Data Centers and Processing-in-Memory (Thursday, April 23, 2026)
• BrainChip and Quantum Ventura’s CyberNeuro-RT™ Named 2026 Enterprise AI Product of the Year by TMCnet (Monday, April 20, 2026)
• BOS Semiconductors to Participate in Auto China 2026, Showcasing Physical AI and Automotive AI SOC Technologies (Monday, April 20, 2026)
• European Commission greenlights €211 million funding for Cambridge graphene photonics spinout (Thursday, April 16, 2026)
• For the Netherlands, Photonics Initiatives Secure Global Leadership—Part 3 (Thursday, April 16, 2026)
• 8 Wi-Fi security guidelines issued by Wireless Broadband Alliance (Thursday, April 16, 2026)
• Synopsys Solutions Support NASA's Artemis Program with Spacesuit Analysis and Communication System Development (Thursday, April 16, 2026)
• Analog Bits Demonstrates Real-Time On-Chip Power Sensing and Delivery on TSMC N2P Process at TSMC 2026 Technology Symposiums (Wednesday, April 15, 2026)
• Nvidia invests $2bn in Marvell for AI ASIC compatibility (Thursday, April 2, 2026)
• Ex-Tenstorrent Execs Start Cloud Provider, AI Lab in Japan (Thursday, April 2, 2026)
• Can Synopsys' Design IP Business Return to Growth in Fiscal 2026? (Thursday, April 2, 2026)
• China’s top chip foundry SMIC unveils action plan for seizing new growth opportunities (Wednesday, April 1, 2026)
• TSMC is preparing to launch the manufacturing of next-generation chips in Japan (Wednesday, April 1, 2026)
• South Korea Unveils $6.5B Strategy to Boost AI, Semiconductor and Strategic Technologies (Wednesday, April 1, 2026)
• NVIDIA AI Ecosystem Expands as Marvell Joins Forces Through NVLink Fusion (Wednesday, April 1, 2026)
• JEDEC® Releases Updated LPDDR5/5X SPD Standard with Enhanced Mode‑Switching Support (Monday, March 30, 2026)
• Memory Is the New Bottleneck in AI Semiconductors (Thursday, March 26, 2026)
• IntoPIX Titanium Apps Achieve IPMX Certification (Monday, March 23, 2026)
• STMicroelectronics accelerates global adoption and market growth of Physical AI with NVIDIA (Thursday, March 19, 2026)
• Memory Moves: Upgrades to HBM4, eMMC, LPDDR5X, & MRAM Across Industries (Thursday, March 19, 2026)
• Soitec and NSIG to agree extension of licensing framework (Monday, March 16, 2026)
• CEA-Leti and NcodiN Partner to Industrialize 300 mm Silicon Photonics for Bandwidth-Hungry AI Interconnects (Thursday, March 12, 2026)
• Axelera Raises $250M in Largest EU Semi Round Ever (Monday, March 9, 2026)
• Nvidia and Lumentum form $2bn AI optics partnership (Monday, March 9, 2026)
• STMicroelectronics enters high-volume production of its industry-leading silicon photonics platform to support AI infrastructure demand (Monday, March 9, 2026)
• Keysight Demonstrates 5G-Advanced AI-Powered Channel State Information Compression and Paves the Way for 6G (Monday, March 9, 2026)
• ST technologies integrated into Qualcomm’s new Snapdragon Wear Elite platform (Thursday, March 5, 2026)