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Friday, January 9, 2026

• TES offers CAN Flexible Data-Rate Controller IP Core for System-on-Chip (SoC) Designs

Thursday, January 8, 2026

• CES 2026 Consumer Tech Trends: EMEA Will Lead Growth
• Siemens unveils mobile showroom experience at CES 2026, bringing the future of adaptive automation directly to industry
• GUC’s HBM4E IP Honored with Best IP / Processor and Five-Year Achievement in EE Awards Asia 2025
• CES 2026: Nordic Semiconductor simplifies edge AI for billions of IoT devices
• Synopsys Showcases Vision For AI-Driven, Software-Defined Automotive Engineering at CES 2026
• SK hynix Showcases Next-Generation AI Memory Innovations at CES 2026
• Siemens unveils technologies to accelerate the industrial AI revolution at CES 2026
• Keysight Launches Software Solution to Ensure Trustworthy AI Deployment in Safety-Critical Environments
• Weebit Nano reports on 2025 targets achievement
• Marvell to Acquire XConn Technologies, Expanding Leadership in AI Data Center Connectivity
• Tenstorrent Unveils First Gen Compact AI Accelerator Device
• Meta and Qualcomm push RISC-V market share towards 25%
• MIPS S8200 Delivers Software-First RISC-V NPU To Enable Physical AI at the Autonomous Edge
• AMD, NVIDIA and Others Reportedly to Debut New Chips at CES 2026, Spotlighting TSMC 3nm and 5nm
• CES 2026: Intel Core Ultra Series 3 Debut as First Built on Intel 18A
• TSMC's 2nm chips: The results are out.
• BAE Systems Licenses Time Sensitive Networking (TSN) Ethernet IP Cores from CAST
• Digital Blocks DB9000 Display Controller IP Core Family Extends Leadership in 8K, Automotive, Medical, Aerospace, and Industrial SoC Designs

Wednesday, January 7, 2026

• Cadence Launches Partner Ecosystem to Accelerate Chiplet Time to Market
• Ceva Enhances NeuPro-Nano NPU Ecosystem with Addition of Sensory’s TrulyHandsfree Voice Activation
• BOS Semiconductors Selects Ceva’s AI DSP for Next-Generation ADAS Platforms
• Ceva Delivers Real-Time AI Acceleration on NXP’s Processors for Software-Defined Vehicles

Tuesday, January 6, 2026

• Creonic Releases Updated SDA OCT IP Core Supporting OCT 4.0 and Enhanced Synchronization

Monday, January 5, 2026

• GUC Monthly Sales Report – Dec 2025
• Nordic Semiconductor and OQ Technology demonstrate direct NTN LEO satellite connectivity
• Five-Year-Old Chinese EDA Firm Univista Sets Sights on IPO, Led by Ex-Synopsys and Cadence Team
• China’s SMIC moves to consolidate domestic chipmaking as it buys out SMNC minority stake.
• SEMI forecasts semiconductor equipment sales reaching $156B by 2027
• EU backs German chip fabs with €623m State aid
• Canada Focuses Funding on Photonics and Quantum
• Initiative CHASSIS for Chiplet Technology in the Automotive Sector
• CES is now a major player in artificial intelligence — thanks to Nvidia CEO Jensen Huang
• IoT in 2026: the technologies driving the next wave of IoT growth
• Japan’s Rapidus set to rival TSMC and Samsung for chip supremacy
• Samsung Emerges as Potential Second Foundry for NVIDIA Alongside TSMC After Groq Licensing Deal
• TSMC begins quietly volume production of 2nm-class chips — first GAA transistor for TSMC claims up to 15% improvement at ISO power
• Chips&Media and Visionary.ai Unveil the World’s First AI-Based Full Image Signal Processor, Redefining the Future of Image Quality
• Weebit Nano secures a license agreement with Texas Instruments

Monday, December 29, 2025

• RISC-V IP: T2M Showcases RISC-V Production IP Core Portfolio for Next-Generation SoCs at CES’26