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Monday, August 3, 2026

• Arm Holdings plc reports results for the first quarter of the fiscal year ending 2027
• SEMI reports 7.4% rise in silicon wafer shipments
• Marvell commits $250m to India expansion as AI and semiconductor development accelerates
• Cyber Resilience Act, Part 2: Security by Design becomes mandatory
• Engineering Matter-ready Home Automation Solutions with Reusable Blueprints
• Radiation-Hardened by Design: Building Interfaces for Space and Nuclear on TSMC CMOS
• Wi-Fi 7 & Wi-Fi 6 RF Transceiver IP Portfolio Expanded by T2M for Next-Generation Wireless SoCs
• Advancing Europe’s Automotive Innovation Ecosystem: Arteris Continues Its Work in the RIGOLETTO Project
• From Trust to Action: Building the Foundations of Trustworthy, Physical AI
• Making Neuromorphic Edge AI Design-Ready with Verified ECAD Models
• Researchers Explore Next-Generation AI Architectures Using Weebit ReRAM
• Stealthium and Tenstorrent Partner to Deliver Runtime Observability for AI Infrastructure
• Weebit Nano expands licensing agreements with key customers; three customer chip designs taped-out to-date
• Making chiplets work for AI requires more than connectivity
• Multi-Die, Multiphysics, and the New Rules of Chip Design
• Intel’s U.S. Advanced Packaging Enables Next-Generation AI Semiconductors
• TSMC Moves Up 1.4nm Mass Production to 2028, Intensifying Rivalry With Samsung

Thursday, July 30, 2026

• Rambus Reports Second Quarter 2026 Financial Results
• Korea secures partnership with AMD to advance domestic AI infrastructure
• Global semiconductor market tops $1.5 trillion for the first time, full interpretation of SIA's latest report
• Cadence Reports Second Quarter 2026 Financial Results
• The Performance Boost for AI: Quantum Computing-Based Methods Make Training of Large Data Models More Efficient
• PQSecure and QuickLogic Demonstrate Reprogrammable Post-Quantum Security for Next-Generation SoCs
• From Co-Packaged Optics to Nanolasers: Photonics Moves Inward
• Keysight Certifies Electromagnetic Design Software for Intel Foundry’s Latest Processes
• Siemens’ IC design solutions now certified for Intel 14A and Intel 18A-P process technologies
• GlobalFoundries signs letter of intent with the U.S. Department of Commerce for a $300 million award to accelerate U.S. silicon photonics leadership
• UMC Announces Fab Expansion in Singapore and Construction of New Fab in Tainan to Meet Accelerating AI Demand

Wednesday, July 29, 2026

• Digital Blocks Marks 20 Years of the DB9000 Display Controller IP Family
• BrainChip AKD1500 Now Available in Compact M.2 Form Factor, Enabling Fanless Edge AI in Industrial and Commercial Designs

Tuesday, July 28, 2026

• Synopsys and Intel Foundry Fast-Track Customer Readiness from Silicon to Systems on Intel 14A
• Synopsys Advances Agentic AI Chip Design with AMD and Microsoft
• Andes Technology and Mirabilis Design Announce Collaboration on System-Level Models for Andes RISC-V Processor IP
• IP Cores, Inc. Releases LZR4D Terabit-Class Ultralow-Latency Single-Engine LZ4 Decompressor Core

Monday, July 27, 2026

• Scalable Network Interconnect IP Core Addresses Growing On-Chip Communication Challenges in Next-Generation SoCs
• Silvaco to Accelerate Physics-Based Digital Twins for Semiconductor Design and Manufacturing Using NVIDIA AI and Accelerated Computing
• Muse Semiconductor and True Circuits Announce New IP Access Program Offering High-quality PLLs to Universities at Low Cost
• Vietnam, Japan launch five joint semiconductor research projects
• How Industrial IoT Is Transforming Semiconductor Manufacturing
• AI in EDA Is Real, It’s Now, and It’s on Show at DAC 2026
• Post-Quantum Cryptography Incorporated into SoCs via eFPGA
• RISC-V Market Size To Exceed $25.07 Billion By 2035
• Charting RISC-V’s Future in HPC
• Siemens advances self-verifying agentic AI workflows for semiconductor and PCB design
• Intel and Lens Technology Collaborate to Enable Advanced Semiconductor Packaging for the AI Era
• Samsung Electronics and Broadcom Expand Strategic Collaboration Across Memory and Foundry Technologies
• Synopsys Showcases Comprehensive Autonomous Engineering Workflows from Silicon to Systems, Developed with NVIDIA Technology
• True Circuits Announces the JSPICE™ Design Environment (JDE™) will be Offered to the JDE Ecosystem Open Source

Saturday, July 25, 2026

• Lee outlines plan to transform Korea into pillar of global AI supply chain
• South Korea’s semiconductor boom risks flatlining under US–China pressure

Friday, July 24, 2026

• Can India become the next semiconductor hub after Taiwan?
• Intel and Fortinet Collaborate to Advance Cybersecurity Innovation and Strengthen Global Supply Chain Resilience
• Synopsys Announces Earnings Release Date for Third Quarter Fiscal Year 2026
• True Circuits Announces the JSPICE™ Design Environment (JDE™) will be Offered Open Source at the Design Automation Conference
• Synopsys Enables AMD Instinct™ MI455X GPU Design with Comprehensive Multi-Die Solution
• Real Intent Launches Riven™ Sign-Off AI Agent for 10X Faster Sign-Off