PVT Controller (Series 5) (Sub-system for complete PVT monitoring), TSMC N3E
1606 Results (281 - 320) |
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eASIC Recognizes Growth in Demand From China and Establishes eASIC Shenzhen WFOE
Jun. 28, 2017 - eASIC, a fabless semiconductor company that delivers a custom integrated circuit (IC) platform (eASIC Platform), today announced the establishment of eASIC (Shenzhen) Technology Services Co. Ltd., a wholly foreign owned enterprise (WFOE) in Shenzen, China. -
ArterisIP and ResilTech Announce Strategic Partnership to Facilitate ISO 26262 Compliance for Complex Autonomous Automotive Systems
Jun. 20, 2017 - ArterisIP and ResilTech S.R.L. today announced a strategic partnership to help semiconductor design teams efficiently validate ISO26262 functional safety levels for automotive systems-on-chip. -
Truechip Collaborates with OmniPhy for Verification of PCIe Gen4 IP solution
Jun. 19, 2017 - Truechip Solutions, the Verification IP specialist and OmniPhy, a leading mixed-signal semiconductor IP company, today announced association for collaborative verification of PCIe Gen 4. The two companies enter into a partnership to provide the customers a solution that is comprehensively tested and ... -
GLOBALFOUNDRIES Launches 7nm ASIC Platform for Data Center, Machine Learning, and 5G Networks
Jun. 13, 2017 - GLOBALFOUNDRIES today announced the availability of FX-7 TM, an application-specific integrated circuit (ASIC) offering built on the company’s 7nm FinFET process technology. FX-7 is an integrated design platform that combines leading-edge manufacturing process technology with a differentiated suite ... -
Vidatronic to Exhibit at 54th Design Automation Conference (DAC) in Austin, TX
Jun. 12, 2017 - Vidatronic, designer and licensor of power management circuit IP, is exhibiting at the 54th annual Design Automation Conference (DAC) this summer in Austin, TX. -
STMicroelectronics Standardizes on Synopsys VC Formal for Faster Verification Closure of Leading Microcontroller Designs
Jun. 07, 2017 - Synopsys, Inc. (Nasdaq:SNPS), today announced that STMicroelectronics selected and standardized on Synopsys VC Formal, as their formal verification solution for advanced microcontroller designs. -
Mentor Ushers in New Era of C++ Verification Signoff with New Catapult Tools and Solutions
Jun. 06, 2017 - Mentor, a Siemens business, today announced three new tools - Catapult® Coverage, Catapult Design Checks and SLEC® HLS – and enhancements to Catapult HLS. -
EDA pioneer Alberto Sangiovanni-Vincentelli joins UltraSoC advisory board
Jun. 01, 2017 - UltraSoC, the leading developer of on-chip monitoring and analytics IP, today announced that Alberto Sangiovanni-Vincentelli, a founding-father and driving force in both commercial and technological developments in the electronics design industry, has joined the company’s Strategic Advisory Board. -
Unprecedented growth at EnSilica sees a major recruitment drive to fuel its continued expansion
May. 22, 2017 - Unprecedented growth of over 80% this year at EnSilica, a leading independent provider of semiconductor solutions and IP, has created a further requirement within the company for a major recruitment drive to fuel its continued expansion in the next 12 months and beyond. -
Cadence Introduces First Interface and Verification IP Solution for CCIX to Advance New Class of Datacenter Servers
May. 02, 2017 - Cadence Design Systems, Inc. (NASDAQ: CDNS) today announced the industry’s first interface and verification IP solution for Cache Coherent Interconnect for Accelerators (CCIX), an open chip-to-chip interconnect standard that advances the development of a new class of server solutions to address the ... -
eASIC and Comcores Announce Support for CPRI V7.0
May. 01, 2017 - eASIC® Corporation, a fabless semiconductor company that delivers a custom integrated circuit (IC) platform (eASIC Platform), and Denmark Headquartered Comcores ApS, a specialized supplier of silicon intellectual property (SIP), today announced the support of CPRI V7.0 (CPRI Specification CPRI_v_7_0 ... -
eASIC and Mobiveil Announce Flash Reliability Platform
Apr. 25, 2017 - eASIC and Mobiveil today announced that Mobiveil’s Flash Reliability IP is now available for use in the eASIC Nextreme-3S family. -
ClioSoft, OneSpin and Truechip Sponsor the Ninth Annual I LOVE DAC Campaign at the 54th Design Automation Conference
Apr. 03, 2017 - ClioSoft, OneSpin Solutions and Truechip; are sponsoring free three-day exhibit floor passes to the 2017 Design Automation Conference (DAC). -
Open-Silicon to Showcase its Spec2Chip IoT SoC Platform Solution Consisting of IoT Edge SoC Platform and IoT Gateway SoC Platform at IoT DevCon Santa Clara on April 26-27, 2017
Apr. 10, 2017 - Open-Silicon, a system-optimized ASIC solutions provider, will be exhibiting at IoT DevCon in Santa Clara on April 26-27, 2017 to demonstrate its IoT Edge SoC Platform and IoT Gateway SoC Platform. Please visit our booth on the exhibition floor to view the demos and to learn about other innovative ASIC/SoC ... -
Cadence Unveils Expanded Virtuoso Advanced-Node Platform for 7nm Processes
Apr. 05, 2017 - Cadence today announced the release of the new Virtuoso® Advanced-Node Platform supporting advanced 7nm designs. Through collaboration with early 7nm FinFET customers, Cadence has expanded the Virtuoso custom design platform with innovative new capabilities to manage design complexity and process effects ... -
Open-Silicon Unveils Industry's Highest Performance Interlaken Chip-to-Chip Interface IP
Apr. 04, 2017 - Open-Silicon today announced its eighth-generation Interlaken IP core, supporting up to 1.2 Tbps high-bandwidth performance and up to 56 Gbps SerDes rates with Forward Error Correction (FEC). -
OmniPHY Unveils 25G Backplane SerDes Silicon on TSMC 28nm Technology
Mar. 30, 2017 - OmniPHY Inc. today announced silicon availability of its industry-leading, low-latency backplane SerDes PHY which delivers enterprise-class performance in demanding backplane applications. -
C-SKY Microsystems selects Dolphin Integration's energy management offering for smart voice-interacted devices
Mar. 27, 2017 - Dolphin Integration, the leading provider of solutions for Energy Management, and Hangzhou C-Sky Microsystems, a China-based embedded microprocessor core IP provider, announced today their collaboration on an ultra-low power human-machine interface SoC platform. -
Cadence Achieves Certification for TSMC's 7nm Process Technology
Mar. 14, 2017 - Cadence today announced several new capabilities resulting from its close collaboration with TSMC to further 7nm FinFET design innovation for mobile and high-performance computing (HPC) platforms. -
GreenWaves Technologies Partners with Open-Silicon to Develop Industry's First IoT Processor Based on PULP and RISC-V
Mar. 13, 2017 - Open-Silicon today announced it was selected by GreenWaves Technologies to develop GAP8, the industry’s first IoT processor. GAP8 is built on the open source Parallel Ultra Low Power (PULP) and RISC-V ISA projects. -
Open-Silicon Announces IoT Gateway SoC Platform
Mar. 13, 2017 - Underscoring its commitment to the IoT market, Open- Silicon today announced the development of an IoT gateway SoC platform that enables complete Spec2Chip development of custom silicon solutions for emerging IoT gateway applications. -
Codasip and TVS Deliver Advanced RISC-V Verification Solutions
Mar. 10, 2017 - Codasip, a leading RISC-V processor IP provider, and T&VS (Test and Verification Solutions), a leading verification services provider for semiconductor IP, hardware and software, today announced a broad collaboration to accelerate the verification of products based on the Codix-Bk series of RISC-V compliant ... -
Arteris Announces PIANO 2.0 Automated Interconnect Timing Closure Technology
Mar. 08, 2017 - Arteris today announced its next generation automated interconnect timing solution – the PIANO 2.0 Timing Closure Package. PIANO 2.0 builds on customer silicon experience gathered with FlexNoC Physical™ package to automate interconnect timing closure for both cache coherent and non-coherent subsystems. ... -
Xilinx Demonstrates Responsive and Reconfigurable Vision Guided Intelligent Systems at Embedded World 2017
Mar. 02, 2017 - Xilinx is demonstrating responsive and reconfigurable vision guided intelligent systems at Embedded World 2017. Conference presentations and demonstrations will show how Xilinx's tools, libraries and methodologies infuse machine learning, computer vision, sensor fusion, and connectivity into vision ... -
Terminus Circuits and Truechip partner for comprehensive verification of High Speed Serial Protocols, viz.: PCIe Gen4 and USB 3.1
Feb. 28, 2017 - Truechip Solutions Pvt. Ltd. (“Truechip”), the Verification IP specialist and Terminus Circuits, a leading provider of High Speed Serial (HSS) Link IP products announced partnership for PCIe Gen4 and USB 3.1 verification. The two companies enter into a partnership to provide the end customers a ... -
Oski Technology Launches Formal Verification IP Portfolio for ARM AMBA Interface Protocols
Feb. 22, 2017 - Oski Technology today announced its move into verification intellectual property (VIP) with immediate availability of the Oski Formal Verification IP Library for ARM® Advanced Microcontroller Bus Architecture (AMBA®) interface protocols. -
Synopsys Extends Verification FastForward Program, Enabling Cadence Incisive and Mentor Graphics Questa Users to Adopt VCS Simulation with Fine-Grained Parallelism Technology
Jan. 30, 2017 - Synopsys today announced it has extended its Verification FastForward Program to the latest 2017.03 release of its industry-leading, high-performance VCS® functional verification solution. . The program enables the users of Cadence® Incisive® and Mentor Graphics® Questa® tools to quickly migrate ... -
Dolphin Integration Receives Open-Silicon's Award for the Emerging IP Partner of the Year 2016 in the Low Power IoT Ecosystem
Jan. 23, 2017 - Dolphin Integration is the first silicon IP vendor to provide a complete offering for minimization of the power consumption of IoT SoCs, both in sleep and active modes. -
Socionext Accelerates Test Generation and Lowers Test Cost Using Synopsys TetraMAX II
Jan. 16, 2017 - Synopsys, Inc. (Nasdaq: SNPS) today announced that Socionext is achieving substantial reduction in test generation time from more than a week to days with TetraMAX® II ATPG, along with 50% fewer patterns, compared to the previous TetraMAX ATPG solution and is planning for usage on a 28-nanometer (nm) ... -
eSilicon Takes TSMC OIP Ecosystem Forum Customers' Choice Award for Best Paper
Nov. 29, 2016 - The paper, Enabling the Expanding Cloud: High-Bandwidth Memory and 2.5D Solutions, was delivered at TSMC’s Open Innovation Platform® Ecosystem Forum on September 22, 2016 in San Jose, CA. The award is based on the popular vote by attendees. -
Imperas and T&VS Partner to Update Software Verification and Validation Methodology for Embedded Systems
Nov. 02, 2016 - Imperas Software and Test and Verification Solutions today announced that they have partnered to promote state-of-the-art software verification and validation (SW V&V) methodologies for embedded systems. -
BaySand Introduces Enhanced FPGA to ASIC Conversion Program With IP Partners and Supporting Tools
Oct. 12, 2016 - BaySand to introduce an enhanced methodology that enables FPGA designers to efficiently convert FPGA designs to ASIC in short time and low risk. The Metal Copy-28 (MC-28) product line is based on the BaySand FG65L technology that can meet and exceed the performance of 28nm FPGAs and deliver up to 50% ... -
Aldec to Highlight ASIC Pre-Silicon Verification Spectrum with Network-On-Chip (NoC) Demonstration at DVCon Europe
Oct. 11, 2016 - Aldec, Inc., a pioneer in mixed HDL language simulation and hardware-assisted verification solutions for system and ASIC designs, will present the spectrum of pre-silicon verification solutions at the DVCon Europe Conference and Exhibition to be held October 19-20, 2016 in Munich, Germany. -
Achronix announces immediate availability of Speedcore embedded FPGA IP for SoC acceleration
Oct. 11, 2016 - Achronix today announced the immediate availability of its Speedcore™ embedded FPGA (eFPGA) IP for integration into customers’ SoCs. Speedcore is designed for compute and network acceleration applications and is based on the same high-performance architecture that is in Achronix’s Speedster™22i ... -
Open-Silicon to showcase ARM Cortex-M based IoT Custom SoC Platform at ARM TechCon
Oct. 03, 2016 - Open-Silicon, a system optimized ASIC solutions provider, will be exhibiting at ARM® TechCon™ 2016 Santa Calara, on Oct. 25 – 27, 2016, and will demonstrate the company’s ARM® Cortex®-M based IoT Custom SoC Platform. -
Open-Silicon Tapes Out Industry's First High Bandwidth Memory (HBM2) IP Subsystem Solution for 2.5D ASICs in 16nm FF+
Sep. 28, 2016 - Open-Silicon, a system-optimized ASIC solution provider, today announced it has successfully taped out the industry’s first High Bandwidth Memory (HBM2) IP subsystem in TSMC’s 16nm FF+ process in combination with TSMC’s CoWoS® 2.5D silicon interposer technology -
Cadence and TSMC Advance 7nm FinFET Designs for Mobile and HPC Platforms
Sep. 23, 2016 - Cadence Design Systems, Inc. (NASDAQ: CDNS) today announced several important deliveries in its collaboration with TSMC to advance 7nm FinFET designs for mobile and high-performance computing (HPC) platforms. -
Synopsys Joins GLOBALFOUNDRIES' FDXcelerator Partner Program to Enable Innovative Designs Using the FD-SOI Process
Sep. 09, 2016 - Synopsys and GLOBALFOUNDRIES today announced that Synopsys has joined the foundry's FDXcelerator™ Partner Program, an ecosystem designed to facilitate 22FDX™ system-on-chip (SoC) designs. -
BaySand Expands Its Board of Directors With Senior Semiconductor Veteran Executive
Aug. 17, 2016 - James Hogan joins BaySand’s board with experience as a senior executive and board director in electronic design automation and intellectual property companies -
Open-Silicon Strengthens Management Team With Key Executive Appointments
Jul. 26, 2016 - Mark Wright, former President of Faraday Technology Corporation, USA, will serve as Senior Vice President of Sales and Marketing for Open-Silicon, and Anam Haque, former Vice President of Engineering for Synapse Design, has been appointed Vice President of Silicon Engineering.