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Monday, October 26, 2026

• Samsung targets 2nm M2800 as Qualcomm evaluates its foundry
• Samsung Prepares Next-Gen 8nm Foundry Technology with Major Improvements
• UMC and AP Memory Collaborate to Enable Advanced Power Delivery Solutions for AI and HPC Systems
• Rambus and ChipAgents Collaborate to Accelerate Chip Design with Agentic AI
• Tenstorrent Releases Open Source Beta of the Open Chiplet Atlas® (OCA) Harness
• Agnisys and Axiomise Collaborate to Accelerate NoC Design and Formal Sign-off
• Taiwan's Egis, France's SiPearl team up on chiplet CPU
• Sound Ecosystem and Scenario Breakthroughs: Seven Sub-forums of RISC-V China Summit Jointly Explore New AI Opportunities
• BrainChip Unveils AKD1500 SPI Chip, Bringing Neuromorphic AI to Everyday Edge Devices
• Processor IP brings generative AI to edge devices
• Embedded Security Market Advances as Fraunhofer Validates 22 nm RISC-V Secure Element for Next-Generation Connected Devices
• Alliance for Open Media Sees Rapid AV2 Adoption Across the Video Ecosystem Just Four Months After Release
• After TSMC, Samsung Is Also Reportedly Planning To Hike Chip Prices Amid Demand Surge Fueled By Nvidia, Apple, Tesla And Others
• Japan govt to invest extra 400 billion yen in Rapidus
• Silicon-Proven 112G SerDes IP Core with WhiteBox Licensing for China's AI and Networking Market

Friday, October 23, 2026

• ODVA Specifies ix Industrial® as a New Ethernet/IP Interface

Thursday, October 22, 2026

• Can GFS' Manufacturing Expansion Boost Its Future Growth Prospects?
• Scaling infrastructure, all-in on NPO, and a "material-rich" road map: Themes and takeaways from Soitec’s 2026 Silicon Photonics Workshop
• Synopsys at NVIDIA GTC Berlin: Delivering Engineering Precision with Speed
• Cadence AI Super Agents Enable Nokia to Accelerate Electronic System Design on Millennium M2000 Supercomputer
• Socionext Expands Agentic AI to Advanced, Large-Scale SoC Physical Design
• Siemens and NVIDIA advance AI-powered PCB inspection from Digital Twin to factory
• Qualcomm buys RISC-V startup Akeana to push into AI and data-center chips
• Cadence Unveils Europe's First Sovereign AI Platform for Semiconductor, System and AI Factory Design in Collaboration with NVIDIA
• SAIMEMORY And SkyeChip Collaborate on Next-Generation memory "ZAM" for AI
• Siemens expands agentic AI collaboration to tackle 3D IC power and thermal challenges with NVIDIA
• Quadric bets on a unified future for Edge AI
• PUFsecurity secures OCP SAFE approval for PUFrt semiconductor IP
• DAMO Academy's XuanTie E908A Is an Automotive RISC-V CPU IP Aimed at ASIL-B and ASIL-D Designs
• Taming the AI Training Beast: Why Ethernet Will Write the Next Chapter of AI
• Qualcomm Wins Key Claims Against Arm, but Damages Total Just $2

Tuesday, October 20, 2026

• Codebat Publishes Development Timeline for Its NIST CAVP-Validated ML-DSA Hardware Engine
• BOS Semiconductors Partners with LG Electronics and HANA Micron to Advance Domestic Development of Chiplet-Based Automotive Semiconductors

Monday, October 19, 2026

• Tenstorrent Announces a $1.5B Series E at a $6.2B valuation
• T2M Showcasing WhiteBox Semiconductor IP Cores Portfolio at ICCAD 2026 – Visit Booth L074
• IBM and Siemens team up to advance 3D nanostack chip technology
• TSMC to Double 2nm Production Capacity by 2027, Widening Gap with Samsung Foundry to 66.6 Percentage Points
• Samsung May Acquire a Silicon Photonics Company to Challenge TSMC
• How Chiplets Could Transform Server Design – And Data Centers
• Tenstorrent at The Open Frontier: RISC-V Everywhere
• As AI transforms organizations, more clear processes become even more important
• intoPIX to Demonstrate JPEG XS, IPMX and SMPTE ST 2110 Solutions at NAB Show New York 2026
• Q1 FY27 Report: Second customer begins silicon validation as Weebit advances commercialization
• Meet ShortLink at Electronica 2026
• Dr Axel Poschmann receives Test of Time Award at CHES 2026
• NVIDIA deepens France AI push with new startup investments and sovereign infrastructure
• All major chip manufacturers are acquiring MCU vendors.
• Intel CEO Lip-Bu Tan stresses that US government investing billions in the company does not mean chip maker is not 'independent', says: They don't have any policy to …
• GlobalFoundries expands US chip investment to $5 billion
• What makes Singapore a prime location for semiconductor companies driving innovation?

Thursday, October 15, 2026

• Siemens extends next-generation data acquisition portfolio for modern physical testing with Simcenter SCADAS ES
• Production-Proven RISC-V CPU IP Cores for Next-Generation SoC Designs at RISC-V Summit China 2026 -T2M
• INTERA to Showcase Edge AI Accelerator IPs at SEMICON 2026 – Booth C2119
• INTERA Launches EAGLE Cognit, Bringing Ultra-Low-Power Near-Memory AI Acceleration to Next-Generation Edge Devices
• GlobalFoundries selected to operate two new semiconductor fabs in New York under landmark U.S.-Japan initiative
• GlobalFoundries Returns to Advanced-Node Race With 7 nm-Class FDX Fusion
• Cadence Wins Five 2026 TSMC OIP Partner of the Year Awards
• Siemens’ Tessent ecosystem enables direct test pattern execution via PCIe and USB
• ForwardEdge ASIC Announces UCIe 3.0 IP Solution to Accelerate Next-Generation Chiplet-Based ASIC Innovation
• Quintauris and Microchip Technology join forces to grow RISC-V® adoption
• Intel Refers to its 3D V-Cache Analog as "BFC"
• BrainChip Launches Sequora: Edge AI That Doesn’t Just Recognize — It Understands and Responds
• Marvell, Microsoft and Oracle Establish OCP Working Group to Standardize Data Center Hardware Security
• PUFsecurity Puts Silicon Root of Trust at the Center of AI Agent Security
• intoPIX to Demonstrate JPEG XS, IPMX and SMPTE ST 2110 Solutions at NAB Show New York 2026
• Samsung Unveils Yongin Cluster Plan as SK hynix Touts Next-Gen Chips
• Global 300mm Fab Equipment Spending to Reach $227 Billion in 2029 as Buildout Accelerates
• NVIDIA deepens France AI push with new startup investments and sovereign infrastructure