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• Arasan announces the immediate availability of the industries first xSPI NOR + eMMC NAND Combo PHY IP (Monday, February 2, 2026)
• Qualitas Semiconductor Secures Strategic IP Licensing Agreement for MIPI Solutions (Friday, January 30, 2026)
• TES is extending its PMU IP portfolio for X-FAB’s XT018 - 0.18µm BCD-on-SOI technology. (Wednesday, January 28, 2026)
• Cadence Unwraps DSP IP Purpose-Built for Next-Gen Voice AI and Audio (Monday, January 26, 2026)
• LPDDR6 Has Arrived ! Innosilicon Technology Delivers LPDDR6 Subsystem IP to Leading Clients (Monday, January 26, 2026)
• YorChip and Sofics Expand UCIe PHY Across TSMC Nodes (Friday, January 23, 2026)
• 'ReRAM is the replacement for (NAND) flash': $170 billion US tech company backs tiny startup in race to find the holy Grail of universal memory (Thursday, January 22, 2026)
• Cadence Unveils Tensilica HiFi iQ DSP Purpose-Built for Next-Generation Voice AI and Audio Applications (Thursday, January 22, 2026)
• T2M Presents TGE200 RISC-V IP Core: Ultra-Low-Power for IoT & MCU Platforms (Monday, January 19, 2026)
• eMemory and PUFsecurity’s PUFPQC Achieves NIST FIPS 205 and SP 800-208 Certification, Reaching a Milestone in Comprehensive Post-Quantum Cryptography Protection (Friday, January 16, 2026)
• SST and UMC Announce Immediate Availability of 28nm SuperFlash® Gen 4 Automotive Grade 1 Platform (Friday, January 16, 2026)
• TES is introducing a new 10-bit SAR ADC IP for XFAB’s XT018 technology. (Thursday, January 15, 2026)
• Cadence Delivers Enterprise-Level Reliability with Next-Gen Low-Power DRAM for AI Applications Featuring Microsoft RAIDDR ECC Technology (Wednesday, January 14, 2026)
• MIPS S8200 Delivers Software-First RISC-V NPU To Enable Physical AI at the Autonomous Edge (Thursday, January 8, 2026)
• Digital Blocks DB9000 Display Controller IP Core Family Extends Leadership in 8K, Automotive, Medical, Aerospace, and Industrial SoC Designs (Thursday, January 8, 2026)
• BOS Semiconductors Selects Ceva’s AI DSP for Next-Generation ADAS Platforms (Wednesday, January 7, 2026)
• Ceva Delivers Real-Time AI Acceleration on NXP’s Processors for Software-Defined Vehicles (Wednesday, January 7, 2026)
• Creonic Releases Updated SDA OCT IP Core Supporting OCT 4.0 and Enhanced Synchronization (Tuesday, January 6, 2026)
• Weebit Nano secures a license agreement with Texas Instruments (Monday, January 5, 2026)
• RISC-V IP: T2M Showcases RISC-V Production IP Core Portfolio for Next-Generation SoCs at CES’26 (Monday, December 29, 2025)
• Cadence Tapes Out UCIe IP Solution at 64G Speeds on TSMC N3P Technology (Friday, December 19, 2025)
• Global Trends Overview: The Rapid Evolution of the USB-C Charging Cable Market (Thursday, December 18, 2025)
• DI3CM-HCI, A High-Performance MIPI I3C Host Controller IP Core for Next-Generation Embedded Designs (Tuesday, December 16, 2025)
• IntoPIX At CES 2026: Premium Visual Experiences — No Compromise. IntoPIX Delivers Real-Time, Low-Power Video Technologies At CES 2026 (Tuesday, December 16, 2025)
• Three PCIe Encryption Weaknesses Expose PCIe 5.0+ Systems to Faulty Data Handling (Monday, December 15, 2025)
• Industry’s First End-to-End eUSB2V2 Demo for Edge AI and AI PCs at CES (Monday, December 15, 2025)
• Silicon Creations and Chip Interfaces Announce Successful Interoperability for JESD204B/C, Interlaken, and CPRI (Friday, December 12, 2025)
• Developing high-performance compute and storage systems (Thursday, December 11, 2025)
• CAST Introduces Microsecond Channel Controller IP Core for Automotive Power and Sensor Interfaces (Thursday, December 11, 2025)
• MEMTECH Unveils New LPDDR3 Memory Subsystem Family with Hyper-Bandwidth, Automotive Safety, and Ultra-Low Power Innovations (Wednesday, December 10, 2025)
• TES Launches 3.3 V CAN Transceiver IP for Single‑Chip Solutions (Tuesday, December 9, 2025)
• Silicon-Proven 16-bit 5MSps SAR ADC IP Cores Optimised for Automotive, Industrial, and IoT (Tuesday, December 9, 2025)
• DVB-S2 Demodulator Available For Integration From Global IP Core (Monday, December 8, 2025)
• Perceptia Announces Availability of Cryogenic 10-bit ADC and DAC IP in GF 22FDX (Monday, December 8, 2025)
• DCD-SEMI Unveils Ultra-Fast DAES IP Core for AES Encryption (Thursday, December 4, 2025)
• VeriSilicon’s NPU IP VIP9000NanoOi-FS has achieved ISO 26262 ASIL B certification (Thursday, December 4, 2025)
• Attopsemi I-fuse® OTP was successfully adopted by Wiliot for IoT Pixels (Wednesday, December 3, 2025)
• WAVE-N v2: Chips&Media’s Custom NPU Retains 16-bit FP for Superior Efficiency at High TOPS (Wednesday, November 26, 2025)
• Perceptia Begins Port of pPLL03 to Samsung 14nm Process Technology (Tuesday, November 25, 2025)
• Qualitas Semiconductor Demonstrates Live of PCIe Gen 6.0 PHY and UCIe v2.0 Solutions at ICCAD 2025 (Tuesday, November 25, 2025)
• Cadence Adds 10 New VIP to Strengthen Verification IP Portfolio for AI Designs (Monday, November 24, 2025)
• VSORA and GUC Partner on Jotunn8 Datacenter AI Inference Processor (Monday, November 24, 2025)
• Mixel MIPI IP Integrated into Automotive Radar Processors Supporting Safety-critical Applications (Thursday, November 20, 2025)
• Dnotitia Revolutionizes AI Storage at SC25: New VDPU Accelerator Delivers Up to 9x Performance Boost (Thursday, November 20, 2025)
• EagleChip Selects CAST TSN IP Core to Enhance Advanced Intelligent Control SoC (Wednesday, November 19, 2025)
• GUC and Ayar Labs Partner to Advance Co-Packaged Optics for Hyperscalers (Monday, November 17, 2025)
• CAST Introduces JPEG XL Encoder IP Core for High-Quality, On-Camera Still-Image Compression (Friday, November 14, 2025)
• VeriSilicon and Google Jointly Launch Open-Source Coral NPU IP (Thursday, November 13, 2025)
• Secure-IC, now a part of Cadence, unveils Securyzr™ Xperience, an Exclusive Gateway to Security Innovation (Wednesday, November 12, 2025)
• Perceptia Updates Design Kit for pPLL03 on GlobalFoundries 22FDX Platform (Thursday, November 6, 2025)