Jan. 22, 2018 - Thalia Design Automation today announced a significant expansion of its analog design engineering capabilities, with the opening of a new engineering center in Hyderabad, India.

Nov. 20, 2017 - Andes Technology today announces the partnership with the world-class tools vendors including Imperas, Lauterbach, Mentor, a Siemens Business, and UltraSoC (in alphabetical order) to bring their system-on-chip (SoC) development environments to Andes V5 processors and the RISC-V community.

Nov. 16, 2017 - Faraday Technology today introduced its M1+ standard cell library on UMC 28HPC process. This optimized M1+ library supports the essential multi-track cells (7T/9T/12T), multi-Vt cells (LVT/RVT/HVT), and Faraday low-power PowerSlash™ kit to build the best portfolio of power, performance, and area metrics ...

Nov. 25, 2017 - GUC today announced the achievement of highly coveted ISO 13485:2016 certification, which make GUC the first and only ASIC company to meet these demanding standards and will strengthen qualities of medical IC design and manufacturing services.

Oct. 16, 2017 - Open-Silicon, a system-optimized ASIC solutions provider, will be exhibiting at ARM TechCon 2017. The company will demonstrate its IoT Edge SoC Platform Solution, IoT Gateway SoC Reference Design and Comprehensive High Bandwidth Memory (HBM2) IP Subsystem Solution for 2.5D ASICs in TSMC 16nm FF+.

Sep. 25, 2017 - Synopsys today announced that the Synopsys Design Platform has been fully certified for use on Samsung Foundry's 28FDS (FD-SOI) process technology. A Process Design Kit (PDK) and a comprehensive reference flow, compatible with Synopsys' Lynx Design System, containing scripts, design methodologies and ...

Sep. 19, 2017 -

Sep. 19, 2017 - AFuzion and HDL Design House invite you to join the free October 4, 2017 webinar on DO-254 optimization techniques including DO-254 requirements, mistakes, best practices, and use of random verification and UVM methodology.

Sep. 12, 2017 -

Sep. 12, 2017 - Open-Silicon, a system-optimized ASIC solution provider, today announced it has successfully completed silicon validation of its High Bandwidth Memory (HBM2) IP subsystem in TSMC’s 16nm FinFET technology in combination with TSMC’s CoWoS® 2.5D silicon interposer technology and HBM2 memory.

Sep. 11, 2017 - Cadence today announced its collaboration with TSMC to advance 7nm FinFET Plus design innovation for mobile and high-performance computing (HPC) platforms.

Sep. 11, 2017 - Synopsys, Inc. (Nasdaq: SNPS) today announced that TSMC has certified IC Compiler™ II place-and-route system and Synopsys Design Platform for the V1.0 production of its latest 12-nanometer (nm) FinFET process technology.

Jul. 27, 2017 - Next Year in 2018, Truechip -The Verification IP specialist, would be celebrating 10 years of continued successfulness. Truechip’s completing 10 years would be a significant milestone for the company.

Jul. 20, 2017 - Cadence today announced that Toshiba Electronic Devices & Storage Corporation used the Cadence® Genus™ Synthesis Solution to complete a successful ASIC design tapeout.

Jul. 20, 2017 - Mentor, a Siemens business, announces that independent compliance firm SGS-TÜV Saar has certified the ISO 26262 compliance of tool qualification reports for key software elements of its groundbreaking new Veloce® Strato™ emulation platform.

Jul. 13, 2017 - Veriest Solutions, a leading VLSI Design Services house, announced that it successfully completed a project with CEVA for the development of a complex neural network signal processing IP.

Jun. 28, 2017 - eASIC, a fabless semiconductor company that delivers a custom integrated circuit (IC) platform (eASIC Platform), today announced the establishment of eASIC (Shenzhen) Technology Services Co. Ltd., a wholly foreign owned enterprise (WFOE) in Shenzen, China.

Jun. 20, 2017 - ArterisIP and ResilTech S.R.L. today announced a strategic partnership to help semiconductor design teams efficiently validate ISO26262 functional safety levels for automotive systems-on-chip.

Jun. 19, 2017 - Truechip Solutions, the Verification IP specialist and OmniPhy, a leading mixed-signal semiconductor IP company, today announced association for collaborative verification of PCIe Gen 4. The two companies enter into a partnership to provide the customers a solution that is comprehensively tested and ...

Jun. 13, 2017 - GLOBALFOUNDRIES today announced the availability of FX-7 TM, an application-specific integrated circuit (ASIC) offering built on the company’s 7nm FinFET process technology. FX-7 is an integrated design platform that combines leading-edge manufacturing process technology with a differentiated suite ...

Jun. 12, 2017 - Vidatronic, designer and licensor of power management circuit IP, is exhibiting at the 54th annual Design Automation Conference (DAC) this summer in Austin, TX.

Jun. 07, 2017 - Synopsys, Inc. (Nasdaq:SNPS), today announced that STMicroelectronics selected and standardized on Synopsys VC Formal, as their formal verification solution for advanced microcontroller designs.

Jun. 06, 2017 - Mentor, a Siemens business, today announced three new tools - Catapult® Coverage, Catapult Design Checks and SLEC® HLS – and enhancements to Catapult HLS.

Jun. 01, 2017 - UltraSoC, the leading developer of on-chip monitoring and analytics IP, today announced that Alberto Sangiovanni-Vincentelli, a founding-father and driving force in both commercial and technological developments in the electronics design industry, has joined the company’s Strategic Advisory Board.

May. 22, 2017 - Unprecedented growth of over 80% this year at EnSilica, a leading independent provider of semiconductor solutions and IP, has created a further requirement within the company for a major recruitment drive to fuel its continued expansion in the next 12 months and beyond.

May. 02, 2017 - Cadence Design Systems, Inc. (NASDAQ: CDNS) today announced the industry’s first interface and verification IP solution for Cache Coherent Interconnect for Accelerators (CCIX), an open chip-to-chip interconnect standard that advances the development of a new class of server solutions to address the ...

May. 01, 2017 - eASIC® Corporation, a fabless semiconductor company that delivers a custom integrated circuit (IC) platform (eASIC Platform), and Denmark Headquartered Comcores ApS, a specialized supplier of silicon intellectual property (SIP), today announced the support of CPRI V7.0 (CPRI Specification CPRI_v_7_0 ...

Apr. 25, 2017 - eASIC and Mobiveil today announced that Mobiveil’s Flash Reliability IP is now available for use in the eASIC Nextreme-3S family.

Apr. 03, 2017 - ClioSoft, OneSpin Solutions and Truechip; are sponsoring free three-day exhibit floor passes to the 2017 Design Automation Conference (DAC).

Apr. 10, 2017 - Open-Silicon, a system-optimized ASIC solutions provider, will be exhibiting at IoT DevCon in Santa Clara on April 26-27, 2017 to demonstrate its IoT Edge SoC Platform and IoT Gateway SoC Platform. Please visit our booth on the exhibition floor to view the demos and to learn about other innovative ASIC/SoC ...

Apr. 05, 2017 - Cadence today announced the release of the new Virtuoso® Advanced-Node Platform supporting advanced 7nm designs. Through collaboration with early 7nm FinFET customers, Cadence has expanded the Virtuoso custom design platform with innovative new capabilities to manage design complexity and process effects ...

Apr. 04, 2017 - Open-Silicon today announced its eighth-generation Interlaken IP core, supporting up to 1.2 Tbps high-bandwidth performance and up to 56 Gbps SerDes rates with Forward Error Correction (FEC).

Mar. 30, 2017 - OmniPHY Inc. today announced silicon availability of its industry-leading, low-latency backplane SerDes PHY which delivers enterprise-class performance in demanding backplane applications.

Mar. 27, 2017 - Dolphin Integration, the leading provider of solutions for Energy Management, and Hangzhou C-Sky Microsystems, a China-based embedded microprocessor core IP provider, announced today their collaboration on an ultra-low power human-machine interface SoC platform.

Mar. 14, 2017 - Cadence today announced several new capabilities resulting from its close collaboration with TSMC to further 7nm FinFET design innovation for mobile and high-performance computing (HPC) platforms.

Mar. 13, 2017 - Open-Silicon today announced it was selected by GreenWaves Technologies to develop GAP8, the industry’s first IoT processor. GAP8 is built on the open source Parallel Ultra Low Power (PULP) and RISC-V ISA projects.

Mar. 13, 2017 - Underscoring its commitment to the IoT market, Open- Silicon today announced the development of an IoT gateway SoC platform that enables complete Spec2Chip development of custom silicon solutions for emerging IoT gateway applications.

Mar. 10, 2017 - Codasip, a leading RISC-V processor IP provider, and T&VS (Test and Verification Solutions), a leading verification services provider for semiconductor IP, hardware and software, today announced a broad collaboration to accelerate the verification of products based on the Codix-Bk series of RISC-V compliant ...

Mar. 08, 2017 - Arteris today announced its next generation automated interconnect timing solution – the PIANO 2.0 Timing Closure Package. PIANO 2.0 builds on customer silicon experience gathered with FlexNoC Physical™ package to automate interconnect timing closure for both cache coherent and non-coherent subsystems. ...

Mar. 02, 2017 - Xilinx is demonstrating responsive and reconfigurable vision guided intelligent systems at Embedded World 2017. Conference presentations and demonstrations will show how Xilinx's tools, libraries and methodologies infuse machine learning, computer vision, sensor fusion, and connectivity into vision ...