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Jul. 20, 2017 -
Cadence today announced that Toshiba Electronic Devices & Storage Corporation used the Cadence® Genus™ Synthesis Solution to complete a successful ASIC design tapeout.
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Jul. 20, 2017 -
Mentor, a Siemens business, announces that independent compliance firm SGS-TÜV Saar has certified the ISO 26262 compliance of tool qualification reports for key software elements of its groundbreaking new Veloce® Strato™ emulation platform.
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Jul. 13, 2017 -
Veriest Solutions, a leading VLSI Design Services house, announced that it successfully completed a project with CEVA for the development of a complex neural network signal processing IP.
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Jun. 28, 2017 -
eASIC, a fabless semiconductor company that delivers a custom integrated circuit (IC) platform (eASIC Platform), today announced the establishment of eASIC (Shenzhen) Technology Services Co. Ltd., a wholly foreign owned enterprise (WFOE) in Shenzen, China.
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Jun. 20, 2017 -
ArterisIP and ResilTech S.R.L. today announced a strategic partnership to help semiconductor design teams efficiently validate ISO26262 functional safety levels for automotive systems-on-chip.
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Jun. 19, 2017 -
Truechip Solutions, the Verification IP specialist and OmniPhy, a leading mixed-signal semiconductor IP company, today announced association for collaborative verification of PCIe Gen 4. The two companies enter into a partnership to provide the customers a solution that is comprehensively tested and ...
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Jun. 13, 2017 -
GLOBALFOUNDRIES today announced the availability of FX-7 TM, an application-specific integrated circuit (ASIC) offering built on the company’s 7nm FinFET process technology. FX-7 is an integrated design platform that combines leading-edge manufacturing process technology with a differentiated suite ...
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Jun. 12, 2017 -
Vidatronic, designer and licensor of power management circuit IP, is exhibiting at the 54th annual Design Automation Conference (DAC) this summer in Austin, TX.
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Jun. 07, 2017 -
Synopsys, Inc. (Nasdaq:SNPS), today announced that STMicroelectronics selected and standardized on Synopsys VC Formal, as their formal verification solution for advanced microcontroller designs.
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Jun. 06, 2017 -
Mentor, a Siemens business, today announced three new tools - Catapult® Coverage, Catapult Design Checks and SLEC® HLS – and enhancements to Catapult HLS.
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Jun. 01, 2017 -
UltraSoC, the leading developer of on-chip monitoring and analytics IP, today announced that Alberto Sangiovanni-Vincentelli, a founding-father and driving force in both commercial and technological developments in the electronics design industry, has joined the company’s Strategic Advisory Board.
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May. 22, 2017 -
Unprecedented growth of over 80% this year at EnSilica, a leading independent provider of semiconductor solutions and IP, has created a further requirement within the company for a major recruitment drive to fuel its continued expansion in the next 12 months and beyond.
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May. 02, 2017 -
Cadence Design Systems, Inc. (NASDAQ: CDNS) today announced the industry’s first interface and verification IP solution for Cache Coherent Interconnect for Accelerators (CCIX), an open chip-to-chip interconnect standard that advances the development of a new class of server solutions to address the ...
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May. 01, 2017 -
eASIC® Corporation, a fabless semiconductor company that delivers a custom integrated circuit (IC) platform (eASIC Platform), and Denmark Headquartered Comcores ApS, a specialized supplier of silicon intellectual property (SIP), today announced the support of CPRI V7.0 (CPRI Specification CPRI_v_7_0 ...
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Apr. 25, 2017 -
eASIC and Mobiveil today announced that Mobiveil’s Flash Reliability IP is now available for use in the eASIC Nextreme-3S family.
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Apr. 03, 2017 -
ClioSoft, OneSpin Solutions and Truechip; are sponsoring free three-day exhibit floor passes to the 2017 Design Automation Conference (DAC).
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Apr. 10, 2017 -
Open-Silicon, a system-optimized ASIC solutions provider, will be exhibiting at IoT DevCon in Santa Clara on April 26-27, 2017 to demonstrate its IoT Edge SoC Platform and IoT Gateway SoC Platform. Please visit our booth on the exhibition floor to view the demos and to learn about other innovative ASIC/SoC ...
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Apr. 05, 2017 -
Cadence today announced the release of the new Virtuoso® Advanced-Node Platform supporting advanced 7nm designs. Through collaboration with early 7nm FinFET customers, Cadence has expanded the Virtuoso custom design platform with innovative new capabilities to manage design complexity and process effects ...
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Apr. 04, 2017 -
Open-Silicon today announced its eighth-generation Interlaken IP core, supporting up to 1.2 Tbps high-bandwidth performance and up to 56 Gbps SerDes rates with Forward Error Correction (FEC).
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Mar. 30, 2017 -
OmniPHY Inc. today announced silicon availability of its industry-leading, low-latency backplane SerDes PHY which delivers enterprise-class performance in demanding backplane applications.
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Mar. 27, 2017 -
Dolphin Integration, the leading provider of solutions for Energy Management, and Hangzhou C-Sky Microsystems, a China-based embedded microprocessor core IP provider, announced today their collaboration on an ultra-low power human-machine interface SoC platform.
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Mar. 14, 2017 -
Cadence today announced several new capabilities resulting from its close collaboration with TSMC to further 7nm FinFET design innovation for mobile and high-performance computing (HPC) platforms.
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Mar. 13, 2017 -
Open-Silicon today announced it was selected by GreenWaves Technologies to develop GAP8, the industry’s first IoT processor. GAP8 is built on the open source Parallel Ultra Low Power (PULP) and RISC-V ISA projects.
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Mar. 13, 2017 -
Underscoring its commitment to the IoT market, Open- Silicon today announced the development of an IoT gateway SoC platform that enables complete Spec2Chip development of custom silicon solutions for emerging IoT gateway applications.
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Mar. 10, 2017 -
Codasip, a leading RISC-V processor IP provider, and T&VS (Test and Verification Solutions), a leading verification services provider for semiconductor IP, hardware and software, today announced a broad collaboration to accelerate the verification of products based on the Codix-Bk series of RISC-V compliant ...
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Mar. 08, 2017 -
Arteris today announced its next generation automated interconnect timing solution – the PIANO 2.0 Timing Closure Package. PIANO 2.0 builds on customer silicon experience gathered with FlexNoC Physical™ package to automate interconnect timing closure for both cache coherent and non-coherent subsystems. ...
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Mar. 02, 2017 -
Xilinx is demonstrating responsive and reconfigurable vision guided intelligent systems at Embedded World 2017. Conference presentations and demonstrations will show how Xilinx's tools, libraries and methodologies infuse machine learning, computer vision, sensor fusion, and connectivity into vision ...
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Feb. 28, 2017 -
Truechip Solutions Pvt. Ltd. (“Truechip”), the Verification IP specialist and Terminus Circuits, a leading provider of High Speed Serial (HSS) Link IP products announced partnership for PCIe Gen4 and USB 3.1 verification. The two companies enter into a partnership to provide the end customers a ...
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Feb. 22, 2017 -
Oski Technology today announced its move into verification intellectual property (VIP) with immediate availability of the Oski Formal Verification IP Library for ARM® Advanced Microcontroller Bus Architecture (AMBA®) interface protocols.
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Jan. 30, 2017 -
Synopsys today announced it has extended its Verification FastForward Program to the latest 2017.03 release of its industry-leading, high-performance VCS® functional verification solution. . The program enables the users of Cadence® Incisive® and Mentor Graphics® Questa® tools to quickly migrate ...
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Jan. 23, 2017 -
Dolphin Integration is the first silicon IP vendor to provide a complete offering for minimization of the power consumption of IoT SoCs, both in sleep and active modes.
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Jan. 16, 2017 -
Synopsys, Inc. (Nasdaq: SNPS) today announced that Socionext is achieving substantial reduction in test generation time from more than a week to days with TetraMAX® II ATPG, along with 50% fewer patterns, compared to the previous TetraMAX ATPG solution and is planning for usage on a 28-nanometer (nm) ...
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Nov. 29, 2016 -
The paper, Enabling the Expanding Cloud: High-Bandwidth Memory and 2.5D Solutions, was delivered at TSMC’s Open Innovation Platform® Ecosystem Forum on September 22, 2016 in San Jose, CA. The award is based on the popular vote by attendees.
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Nov. 02, 2016 -
Imperas Software and Test and Verification Solutions today announced that they have partnered to promote state-of-the-art software verification and validation (SW V&V) methodologies for embedded systems.
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Oct. 12, 2016 -
BaySand to introduce an enhanced methodology that enables FPGA designers to efficiently convert FPGA designs to ASIC in short time and low risk. The Metal Copy-28 (MC-28) product line is based on the BaySand FG65L technology that can meet and exceed the performance of 28nm FPGAs and deliver up to 50% ...
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Oct. 11, 2016 -
Aldec, Inc., a pioneer in mixed HDL language simulation and hardware-assisted verification solutions for system and ASIC designs, will present the spectrum of pre-silicon verification solutions at the DVCon Europe Conference and Exhibition to be held October 19-20, 2016 in Munich, Germany.
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Oct. 11, 2016 -
Achronix today announced the immediate availability of its Speedcore™ embedded FPGA (eFPGA) IP for integration into customers’ SoCs. Speedcore is designed for compute and network acceleration applications and is based on the same high-performance architecture that is in Achronix’s Speedster™22i ...
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Oct. 03, 2016 -
Open-Silicon, a system optimized ASIC solutions provider, will be exhibiting at ARM® TechCon™ 2016 Santa Calara, on Oct. 25 – 27, 2016, and will demonstrate the company’s ARM® Cortex®-M based IoT Custom SoC Platform.
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Sep. 28, 2016 -
Open-Silicon, a system-optimized ASIC solution provider, today announced it has successfully taped out the industry’s first High Bandwidth Memory (HBM2) IP subsystem in TSMC’s 16nm FF+ process in combination with TSMC’s CoWoS® 2.5D silicon interposer technology
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Sep. 23, 2016 -
Cadence Design Systems, Inc. (NASDAQ: CDNS) today announced several important deliveries in its collaboration with TSMC to advance 7nm FinFET designs for mobile and high-performance computing (HPC) platforms.