High Bandwidth Memory 3 (HBM3/3E) IP optimized for Samsung SF4X
1623 Results (1001 - 1040) |
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Xilinx Ships World's Highest Performance DSP Platform with New Virtex-5 SXT FPGAs
Feb. 05, 2007 - Integrated platform combines enhanced DSP blocks for parallel processing, highest memory-to-logic ratio, and low-power serial transceivers for highest I/O bandwidth -
OKI Electric Industry Selects Eureka Technology 4-Lane PCI Express IP Core
Feb. 01, 2007 - The Eureka PCI Express Controller Core includes the Transaction Layer, Data Link Layer and Physical Layer of the PCI Express Specification. It conforms to the latest PCI Express revision and supports industrial standard PIPE interface for on-chip PHY core and external PHY chips. With technology independent ... -
CAST Introduces SOC Kernels, Combining Essential IP Cores and Software for Easier System Development
Jan. 30, 2007 - These Kernels combine multiple IP cores for basic system functions with boot code, drivers, and other underlying software in a pre-integrated, pre-verified package. This provides a significant head start for complex systems, and, together with the designer’s choice of 32-bit processor, is the quickest ... -
YOGITECH Launches Industry First SIL3 Compliant IP For Safety-Critical Systems
Jan. 29, 2007 - fRMEM is available for SRAM connected to the system bus, for Tightly Coupled Memories, caches and for non volatile memories (Flashes, NAND Flashes and EEPROM). fRMEM is also designed to allow interoperability with external Built-In-Self-Test or Built-In-Self Repair modules -
DAFCA Announces Commercial Silicon Success
Jan. 22, 2007 - DAFCA, Inc, the leading vendor of on-chip reconfigurable infrastructure and tools for in-system, at-speed silicon validation, announced today they achieved their first commercial silicon implementations, and landed their sixth customer, in the fourth quarter of 2006 -
Improv Systems Names Industry Veteran Victor Berman as New CEO
Jan. 18, 2007 - Berman takes the reins of the company as it begins a new phase of growth and expansion, targeting high-growth applications such as mobile media and digital TV and new geographic markets with its unique processing technology and accompanying tool suite. -
Ingot Systems Announces System Optimized PCI-Express x1 and x4 IP Cores
Jan. 08, 2007 - The IP7101 PCI-Express x1 IP Core and the IP7104 PCI-Express x4 IP Core are fully compliant with the PCI Express Base Specification v1.0a and v1.1, and are optimized for small die size, low-latency and very high payload bandwidth -
Synplicity Revolutionizes ASIC Verification Methodology with new TotalRecall Technology
Jan. 08, 2007 - Technology Provides High-Speed Verification and Complete Bug Visibility -
Sagem Défense Sécurité Integrate Celoxica ESL and MVI IP into Product Design Flows
Dec. 04, 2006 - Programmable Multimedia, Video & Imaging IP Coupled with Proprietary Solutions for Rapid Product Turnaround and Platform Configurability -
Cadence Enterprise System-Level Verification Enables Predictable Software, Hardware and System Quality
Dec. 04, 2006 - Automated Embedded Software Verification, System-Wide Management and New High-Performance Engines Integrated for Multiple Specialists -
Low Power Hard Core Diamond Standard Processor for TSMC 0.18-micron Technology Available Through Global Unichip
Dec. 04, 2006 - First Hardened Diamond Standard Processor Available; Reduces SOC Integration Cost -
Cadence strengthens Verification Alliance program in India by adding 13 new partners
Nov. 28, 2006 - Program Helps Customers Tap into a Ready Resource of Experts in Cadence Verification Technology and Methodology -
Cadence Aligns with IBM to Accelerate ASIC Design with Cadence Logic-Design Team Technology
Nov. 13, 2006 - his new kit provides IBM's ASIC customers with an optimized path for automated test solutions and test logic-design processing at 65 nanometers. The companies will cooperatively support customers using the ASIC kit -
Evatronix to host technical seminars at the company stand during Electronica 2006
Nov. 06, 2006 - Industry experts share their ideas about system-on-chip engineering with Electronica visitors -
GDA Technologies Accepted into TSMC's Design Center Alliance Program
Nov. 03, 2006 - GDA Technologies today announced it has decided to join the Taiwan Semiconductor Manufacturing Company's Design Center Alliance (DCA) Program. -
Six New IP Providers Join Cadence OpenChoice; Expand IP Program to Enhance the Design Chain Ecosystem
Nov. 02, 2006 - ChipIdea, Fabbrix, GDA, Ingot, Intelliprop and IPextreme Become OpenChoice Members to Simplify the Process of IP Integration Into Customer Designs -
ARM Strengthens Physical IP Portfolio By Adding Silicon On Insulator Technology Through SOISIC Acquisition
Oct. 31, 2006 - ARM today announced it has acquired SOISIC, a leading company in Physical IP based on Silicon on Insulator (SOI) technology. -
Xilinx XtremeDSP Development Tools Reduce Power and Extend Performance for Virtex-5 DSP Applications
Oct. 30, 2006 - AccelDSP and System Generator for DSP 8.2 Tools support 65nm Virtex-5 LX and LXT FPGAs -
Chartered Invests in Design Services Firm to Enhance Design Readiness of Value-Added Solutions
Oct. 30, 2006 - -
ARM Selected To Deliver Low-Power and High-Performance Libraries For IBM, Chartered and Samsung 45-Nanometer Common Platform Technology
Oct. 26, 2006 - Companies extend relationship to enable customers’ time-to-market advantage for advanced SoC design and semiconductor manufacturing solutions -
Atrenta Secures $16M in Series D Funding
Oct. 19, 2006 - Atrenta, the leading provider of broad-based design analysis solutions with the industry standard SpyGlass technology, has successfully secured $16 million in new equity financing. Investor Growth Capital led the financing in this Series D round -
European initiative promotes new standards-based SoC design environments
Oct. 18, 2006 - A group of 15 leading European Semiconductor companies, Intellectual Property (IP) vendors, Electronic Design Automation (EDA) companies and academic institutions specializing in advanced silicon chip design today announced that they are working jointly -
EE Solutions Licenses Diamond Standard 108Mini Processor Core for High Performance, Low Power
Oct. 17, 2006 - Tensilica, Inc. today announced that EE Solutions (EES) of Hsinchu, Taiwan, a leading design service provider with considerable expertise in SOC (system-on-chip) design, has licensed the Diamond Standard 108Mini processor core for a high-performance, low- -
Novelics, a memory IP provider for versatile and differentiated memory IPs, announces its entry in the IP market
Oct. 11, 2006 - Founded in May 2005, Novelics comprises a team of seasoned engineering and management professionals whose backgrounds represent the convergence of three key areas: embedded memory volatile/non volatile memory (NVM) architectures, compiler design, and cust -
Wintegra Selects Denali's Verification Software for Design of Next-Generation Access Processors
Oct. 09, 2006 - Denali’s MMAV IP Product Used for DDR Memory System Verification -
Improv Systems Signs Agreement with BOSTON DSM to Expand Sales and Support
Oct. 02, 2006 - Configurable DSP Pioneer Adds Experienced Channel Partner To Cover Eastern US -
Aragio Solutions Offers Suite of High-Performance Mixed-Signal IP and I/O Libraries Targeted to Advanced Processes from Chartered
Sep. 29, 2006 - Critical IP Components Available on Chartered’s Leading-Edge Manufacturing Platform -
CoWare Appoints Allen Spence Vice-President Worldwide Services
Sep. 26, 2006 - CoWare, Inc., the leading supplier of platform-driven electronic system-level (ESL) design software and services, announced that Allen Spence has joined the company as vice-president of worldwide services, reporting to CoWare president and CEO, Alan Nauma -
Fujitsu Licenses MoSys 1T-SRAM(R) Technology for Its Leading-Edge 65nm Semiconductor Manufacturing Process
Sep. 20, 2006 - Targets Graphic Applications with Low Power, Fast Speed, and High-Density Embedded Memory Requirements -
Cadence Announces Availability of Design-In IP Portfolio for Memory Designs
Sep. 18, 2006 - Leverages IP From Altera and Micron to Shave Weeks off DDR2 Interface Design Time -
Arasan Chip Systems licenses it's USB 2.0 Hub IP Core to Broadcom
Sep. 18, 2006 - Arasan has licensed its USB 2.0 Hub IP Core to Broadcom Corporation. Arasan counts Broadcom as one of its key licensees and other IP’s in use by Broadcom include our Standard SD / SDIO / MMC 4.0 / CE-ATA Host Core and the SDIO Card Core technology. -
DDR PHY Interface Specification to be Unveiled Next Week at MemCon
Sep. 06, 2006 - ARM, Denali, Intel, Rambus, Samsung, and Synopsys team on specification to address development challenges for DDR-DRAM memory systems -
John Geis joins Ingot as VP of Sales
Aug. 28, 2006 - John brings over 20 years of experience in the semiconductor industry to Ingot. He was most recently at Broadcom (BRCM) where he was responsible for strategic sales of high volume wireless products to Top 3 global PC OEM/ Printer accounts. -
CEVA Increases Commitment to Taiwan Market With Increased Local Presence
Aug. 17, 2006 - Expanded Local Support Team, Attendance at Embedded Systems Conference Taiwan and Launch Of Technical Seminar for Embedded Systems Engineers Bolsters Presence in Market -
Cadence links with China designer for IP consulting
Aug. 09, 2006 - An IP design center here and Cadence Design Systems Inc. are joining forces to offer IP design-in consultation services for small- and mid-sized chip companies in the Yangtze Delta area -
K-MICRO Adopts MOSAID Mobilize IP Platform for ASIC Products
Aug. 08, 2006 - MOSAID Technologies and K-MICRO today announced that the MOSAID Mobilize™ IP (intellectual property) platform will be integrated into K-MICRO's low-power, low-leakage 90nm ASIC products. -
Cadence Introduces Universal Verification Components; First Verification-Plan-Enabled Verification IP Integrates Compliance Management and Mixed Language Support
Aug. 07, 2006 - UVCs, part of Cadence's strategy to deliver VIP that spans the entire verification process, maximize quality, predictability and efficiency, while minimizing schedule delay risks and the need for specific protocol expertise. This enables customer to focus -
Tahoe RF Semiconductor Announces Four (4) New 'Ready for IBM Technology' Validations
Aug. 07, 2006 - With extensive design experience in IBM's RF CMOS: 6RF, 7RF and SiGe BiCMOS: 5HP, 5AM, 5PA, 6HP, 7WL, 5HPE, 7HP process technologies, Tahoe RF is the premier full-service custom wireless semiconductor design services provider -
Global Unichip Introduces H.264 Total Solution Verified on GPrime Platform
Aug. 03, 2006 - This solution has been fully verified on GUC’s GPrime/UMVP-2000 AMBA-based Platform, which is composed of H.264 synthesizable RTL cores, AHB wrapper, video output module, and AV-Sync. GUC’s H.264 total solution aims to facilitate customers’ SoC designs on -
Cadence And ARM Introduce First Automated Design And Implimentation Flow For The ARM Cortex-A8 Processor
Jul. 24, 2006 - ARM-certified Encounter RTL Design and Implementation Flow Boosts Productivity, Shortens Time to Market in Next-generation Mobile and Consumer Applications