MIPI C-PHY v1.2 D-PHY v2.1 TX 2 trios/2 Lanes in TSMC (16nm, 12nm, N5)
D&R Headline News (Last 14 Days)
Headlines for Thursday May. 02, 2024
Latest News- Worldwide Silicon Wafer Shipments Dip 5% in Q1 2024, SEMI Reports
- GOWIN's progress in global automotive market gathers momentum with award of ISO 26262 certification for its FPGA design environment
- PCI-SIG® Announces CopprLink™ Cable Specifications for PCIe® 5.0 and 6.0 Technology
- Radiation-Tolerant PolarFire® SoC FPGAs Offer Low Power, Zero Configuration Upsets, RISC-V Architecture for Space Applications
Headlines for Wednesday May. 01, 2024
Packetcraft Delivers Bluetooth Software Enabling Channel Sounding to Early Access Licensees
Channel Sounding is set to deliver high-accuracy distance measurement for secure access, location-based services and asset tracking in automotive + IoT markets- QuickLogic Releases Aurora 2.6 with Expanded Operating System Support and Up to 15% Faster Performance
- Rapid Silicon Introduces Revolutionary Rapid eFPGA Configurator for Hassle Free Embedded FPGA Evaluation
Headlines for Tuesday Apr. 30, 2024
Latest News- Silvaco Announces Launch of Initial Public Offering
- Rambus Reports First Quarter 2024 Financial Results
Headlines for Monday Apr. 29, 2024
TSMC's A16 Process Moves Goalposts in Tech-Leadership Game
Taiwan Semiconductor Manufacturing Co. (TSMC) has changed the tech leadership game with the announcement of its latest A16 chipmaking process, which analysts say may be a leap ahead of Intel’s 18A node.- EDA toolset parade at TSMC's U.S. design symposium
- Altera in negotiation on private equity partner
- Rambus Expands Chipset for Advanced Data Center Memory Modules with DDR5 Server PMICs
- Arm China's ex-CEO sets up RISC-V company
- CAN FD Controller & LIN 2.1 Controller IP Cores, Available for Immediate Licensing with Proven Automotive Compatibility
Headlines for Friday Apr. 26, 2024
TSMC plans 1.6nm process for 2026
TSMC is planning a 1.6nm process, called A16, for production in 2026 alongside a wafer-scale chiplet substrate and an automotive chiplet process.- Thalia's AMALIA 24.2 introduces pioneering estimated parasitics feature to reduce PEX iterations by at least 30%
- Qualitas Semiconductor Partners with TUV Rheinland Korea to Enhance ISO 26262 Functional Safety Management System
Headlines for Thursday Apr. 25, 2024
M31 has successfully launched MIPI C/D PHY Combo IP on the advanced TSMC 5nm process
M31 Technology Corporation (M31), a leading global provider of silicon intellectual property (IP), announced that the M31 MIPI C/D-PHY Combo IP has obtained silicon validation on the advanced TSMC 5nm process and the company has already started 3nm IP development.- Ceva multi-protocol wireless IP could simplify IoT MCU and SoC development
- Controversial former Arm China CEO founds RISC-V chip startup
- Fundamental Inventions Enable the Best PPA and Most Portable eFPGA/DSP/SDR/AI IP for Adaptable SoCs
- Cadence and TSMC Collaborate on Wide-Ranging Innovations to Transform System and Semiconductor Design
- Numem at the Design & Reuse IP SoC Silicon Valley 2024
- Synopsys Accelerates Next-Level Chip Innovation on TSMC Advanced Processes
Headlines for Wednesday Apr. 24, 2024
TSMC Celebrates 30th North America Technology Symposium with Innovations Powering AI with Silicon Leadership
TSMC today unveiled its newest semiconductor process, advanced packaging, and 3D IC technologies for powering the next generation of AI innovations with silicon leadership at the Company’s 2024 North America Technology Symposium.- Keysight, Synopsys, and Ansys Deliver Radio Frequency Design Migration Flow to TSMC's N6RF+ Process Node
- Siemens collaborates with TSMC on design tool certifications for the foundry's newest processes and other enablement milestones
- Leveraging Cryogenics and Photonics for Quantum Computing
- Kalray Joins Arm Total Design, Extending Collaboration with Arm on Accelerated AI Processing
Headlines for Tuesday Apr. 23, 2024
Rambus Advances AI 2.0 with GDDR7 Memory Controller IP
As the latest addition to the Rambus portfolio of industry-leading interface and security digital IP for AI 2.0, the GDDR7 memory controller will provide the breakthrough memory throughput required by servers and clients in the next wave of AI inference.- Credo at TSMC 2024 North America Technology Symposium
- Cadence Reports First Quarter 2024 Financial Results
- Faraday Reports First Quarter 2024 Results
- RAAAM Memory Technologies Closes $4M Seed Round to Commercialize Super Cost Effective On-Chip Memory Solutions
- Alphawave Semi Audited Results for the Year Ended 31 December 2023
- Qualitas Semiconductor Appoints HSRP as its Distributor for the China Markets
- Huawei Mate 60 Pro processor made on SMIC 7nm N+2 process
Headlines for Monday Apr. 22, 2024
Silicon Creations Reaches Milestone of 10 Million Wafers in Production with TSMC
Silicon Creations, a leading supplier of high-performance analog and mixed-signal intellectual property (IP), announced a significant milestone: surpassing 10 million wafers in production containing Silicon Creations IP in collaboration with TSMC, the world's leading dedicated semiconductor foundry.- Analog Bits to Demonstrate Numerous Test Chips Including Portfolio of Power Management and Embedded Clocking and High Accuracy Sensor IP in TSMC N3P Process at TSMC 2024 North America Technology Symposium
- T2M-IP Unveils Revolutionary MIPI D-PHY & DSI Controller IP Cores with speed 2.5Gbps/lane, Redefining High-Speed Data Transfer and Display Interfaces
Headlines for Friday Apr. 19, 2024
Omni Design Technologies Joins Intel Foundry Accelerator IP Alliance
Omni Design Technologies, a leading provider of high-performance, low-power mixed-signal intellectual property (IP), today announced it has joined the Intel Foundry Accelerator IP Alliance.- Efabless Announces the Release of the OpenLane 2 Development Platform, Transforming Custom Silicon Design Flows
- TSMC Reports First Quarter EPS of NT$8.70
- Brisbane Silicon publishes DPTx 1.4 IP Core
- GUC provides 3DIC ASIC total service package to AI/HPC/Networking customers
- DVB-S2X Wideband LDPC/ BCH Decoder IP Core Available For Integration From Global IP Core
Headlines for Thursday Apr. 18, 2024
Dolphin Design expands GoAsic partnership to enhance the semiconductor Industry's Supply Chain
Dolphin Design, a pioneer in silicon IPs specializing in power-management, Audio and Very Edge Computing with AI capabilities, announces it is expanding its GoASIC! Program to enhance the semiconductor industry.- Cadence Announces Most Comprehensive True Hybrid Cloud Solution to Provide Seamless Data Access and Management
- Cadence Collaborates with MemVerge to Increase Resiliency and Cost-Optimization of Long-Running High-Memory EDA Jobs on AWS Spot Instances
- M31 Successfully Validates 5nm IP Solution to Empower Global AI Applications
- Cadence Unveils Palladium Z3 and Protium X3 Systems to Usher in a New Era of Accelerated Verification, Software Development and Digital Twins
- Faraday Partners with Arm to Innovate AI-driven Vehicle ASICs
Headlines for Wednesday Apr. 17, 2024
Zhuhai Chuangfeixin: OTP IP Based on 90nm CMOS Image Sensor Process Technology Successfully Mass-Produced
Zhuhai Chuangfeixin Technology Co., Ltd.(CFX), a leading one-stop NVMIP (Non-Volatile Memory IP) provider in China, recently announced that its OTP IP (One-Time Programmable memory IP core) for 90nm CMOS Image Sensor (CIS) process technology has successfully entered mass production at one of the top five global foundries.- JEDEC Updates JESD79-5C DDR5 SDRAM Standard: Elevating Performance and Security for Next-Gen Technologies
- Alphawave Semi: FY 2023 and 2024 YTD Trading Update and Notice of Results
- Silvaco Announces Expanded Partnership with Micron Technology
- U.S. Subsidy for TSMC Has AI Chips, Tech Leadership in Sight
- Rivos Raises More Than $250M Targeting Data Analytics and Generative AI Markets