D&R Headline News (February 2013)

Headlines for Feb. 28, 2013

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Arasan Announces eMMC 5.0 Total IP Solution at Mobile World Congress

Arasan announced today support for the upcoming eMMC 5.0 specification which is proceeding to ratification within the JEDEC standards organization. The eMMC Total IP Solution comprises digital and analog IP cores, software stack, firmware and a hardware validation platform.

• Dreamchip Electronics Announces Plan for India's Own Processor Based Tablet SoC
• Freescale eyes ARM server play
• PLDA and ReFLEX CES announce new line of System-on-Module (SoM) products, combining the ease of programming of a CPU with the configurability of an FPGA
• Violin Memory Selects eASIC for Flash Memory Arrays
• Methodics Unveils Industry First Complete Verification Management System for Analog Design

Headlines for Feb. 27, 2013

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VLSI Plus offers Multiple Video Source MIPI CSI2 Transmitter IP core

VLSI Plus today announced at the MWC conference the availability of the SVT-CS4-AP2 – a MIPI® CSI2 compliant serial video transmitter, supporting multiple concurrent video sources, and employing from 1 to 4 DPHY lanes at up to 1.5Gbps per lane.

• Freescale and ARM Extend Relationship with Cortex-A50 Processor License for Future i.MX and QorIQ Products
• PCI-SIG and MIPI Alliance Announce Mobile PCIe (M-PCIe) Specification
• MIPI Alliance Boosts Specifications for Camera and Transport Layers in Mobile Device Applications
• Silicon Image Announces New 60GHz WirelessHD RF Receiver for HD Displays
• AM3D Audio Enhancement Ported to Tensilica's HiFi Audio DSPs
• Freescale Introduces Kinetis KL02, World's Smallest ARM Powered Microcontroller
• GainSpan Unveils Industry First Wi-Fi and ZigBee IP Single Chip
• Cryptography Research Signs License Agreement with EchoStar for CryptoFirewall Security Technology to Combat Piracy

Headlines for Feb. 26, 2013

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Altera to Build Next-Generation, High-Performance FPGAs on Intel's 14 nm Tri-Gate Technology

Altera and Intel today announced that the companies have entered into an agreement for the future manufacture of Altera FPGAs on Intel's 14 nm tri-gate transistor technology.

• Atmel Expands Third-Party Ecosystem of Tools and Software Partners for Recently Launched ARM Cortex-A5 Processor-based Family
• CEVA DSPs Continue to Lead the Way at Mobile World Congress
• Adoption of ARM big.Little Technology Accelerates
• Nextchip selects Cortus APS5 for Automotive and Security Applications
• videantis Announces Completion of New Financing Round
• OneSpin Solutions, Oasys Design Systems Ink OEM Agreement
• Socle Technology Now Offers Arteris FlexNoC Platform
• Altera and TSMC Continue Long-Term Partnership
• ZTE and Imagination Technologies announce availability of VoLTE on commercial handsets

Headlines for Feb. 25, 2013

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Global Businesses Select ARM Mali GPU Technology

ARM’s Mali™ GPU Partners report a significant increase in shipments – rising to more than 150 million processors in 2012 – and licenses grow by 30% due to superior graphics performance

• Arasan Chip Systems Reaffirms Commitment to MIPI Alliance at the Mobile World Congress
• Marvell Selects Cryptography Research's CryptoFirewall Anti-Counterfeiting Technology for Use in Consumable Security Chip
• VESA Introduces Updated Dual-Mode Standard for Higher Resolution Interoperability with HDMI Displays
• Rambus Unveils Binary Pixel Technology that Dramatically Improves Photo Quality in Mobile Devices
• Xilinx Announces Full Production of its Entire Zynq-7000 All Programmable SoC Family
• Altera Introduces FPGA-Based HSR/PRP Reference Design Targeting Smart Grid Automation Equipment
• ASOCS and CMCC team up to deliver mass market high capacity, commercially viable C-RAN solutions
• DSP Group License CEVA Audio DSP for HDClear Voice Enhancement Solution
• MagnaChip Selects Synopsys' Proteus LRC for Lithography Verification
• MIPI® Alliance and VESA® Announce Liaison to Collaborate on Data Compression Schemes for Mobile Display Applications
• Silicon Image MHL Technology Featured on New MediaTek Quad-Core Mobile Computing Reference Platform
• Sequans introduces LTE-Advanced Chip
• Imec and Target present multi-standard low-power LDPC engine for multi-Gbps wireless communication
• Tensilica and Sensory Drive Industry's Lowest Power DSP-Based Voice Activation Solution
• Tensilica and Huawei Expand Strategic Relationship for Next-Generation Products
• MIPS processor cores power Ceragon Networks' next generation multi-core packet radio
• Power efficiency is now the dominant factor in mobile design says Imagination
• PowerVR G6100 Series6 "Rogue" core enables mass-market OpenGL ES3.0
• LTE and LTE advanced baseband processing get performance boost from MIPS multi-threaded cores
• Expectations set by mobile devices are driving other consumer categories to "get smart", says Imagination
• CSR Licenses aptX Low Latency Codec to Mad Catz for New Family of Bluetooth Wireless Gaming Headsets
• Imagination joins Open Handset Alliance

Headlines for Feb. 22, 2013

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ARM and Synopsys Collaborate to Optimize ARM Mali GPU 20nm Implementation

ARM and Synopsys today announced a collaboration to optimize performance of ARM® Mali™ graphics processing units (GPUs) in 20-nanometer (nm) and smaller process geometries using the Synopsys Galaxy™ Implementation Platform.

• ST-Ericsson brings PC speeds to mobile devices: First 3GHz smartphone prototype demo at Mobile World Congress
• North American Semiconductor Equipment Industry Posts January 2013 Book-to-Bill Ratio of 1.14
• Xilinx and TEKTELIC Reduce Cellular Radio Infrastructure Development Time with Scalable IP and High Performance Transceiver

Headlines for Feb. 21, 2013

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Qualcomm and Samsung Dominate the LTE cellphone Modem Market but Tiny GCT Semiconductor, Renesas Mobile and Nvidia are New Players

With 86% of the 47 million FDD-LTE cellphone modems shipped last year, Qualcomm will certainly continue its domination in 2013. Samsung followed with 9% of the shipments, while tiny GCT Semiconductor managed to grab 3% of the market, primarily through LG handsets. Renesas Mobile (mostly in Fujitsu handsets) and Nvidia-Icera each garnered 1% market shares.

• IDT Announces Data Compression IP Offering Industry's Highest Performance for 3G and 4G Wireless Infrastructure Applications
• Xylon Announces the Multi-Featured ADAS Kit for Vision-Based Driver Assistance
• Allegro DVT showcases its HEVC/H.265 Video Decoder IP at Mobile World Congress 2013
• LTE, quad-core apps processor wars begin
• Mentor Graphics Expands Automotive Linux Infotainment Business
• IAR Systems supports the XMC1000 low-price ARM Cortex-M0 microcontrollers from Infineon
• Inside Secure Demonstrates End-To-End Security for Next-Generation Home Energy Gateways
• HIMA Licenses ColdFire V4 Technology from IPextreme
• Dialog Semiconductor delivers critical system power management for tablets based on the next generation Intel Atom processors
• Baidu taps Marvell for ARM storage server SoC
• Synopsys Posts Financial Results for First Quarter Fiscal Year 2013
• Xilinx Demonstrates 10 Leading Applications Showcasing ARM Processor-based Zynq-7000 All Programmable SoCs at Embedded World 2013
• SimpLight Achieves First LTE Modem Silicon Success Using Tensilica's Complete ATLAS Reference Platform
• Tensilica to Showcase Complete IP Solutions for Video, Imaging, Audio, Voice, DTV Demodulation and Baseband Communications at Mobile World Congress 2013
• Lattice Semiconductor Names Mark Wadlington Corporate Vice President of World Wide Sales
• Networking Leaders Collaborate to Maximize Choice, Performance and Power Efficiency
• Ultra-low power processor operates at near-threshold voltage
• 1.9nJ/b Ultra-low power 2.4GHz multi-standard radio compliant to Bluetooth Low Energy and ZigBee
• Samsung Electronics Joins OSPT Alliance Board

Headlines for Feb. 20, 2013

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Achronix Now Shipping 22nm Speedster22i FPGAs to Customers

Achronix Semiconductor Corporation announced today that it has begun shipping the industry-leading Speedster®22i HD1000 FPGA to customers. Built on Intel’s advanced 22nm, 3-D Tri-Gate transistor technology, Speedster22i HD devices consume half the power and are half the cost of competitive high‑end FPGAs for targeted high bandwidth applications.

• Xilinx Launches Fully Adaptive Gbps Class Point-to-Point Microwave Modem IP for Backhaul Applications
• Imagination achieves OpenGL ES 3.0 conformance for PowerVR Series6 cores
• Elliptic Technologies to Exhibit Embedded Silicon Security Solutions Devoted to Content Protection and Networking Applications at RSA Conference 2013
• Reflex CES Demonstrates SoC FPGA-Based System-on-Module at Embedded World 2013; Highlights Prototyping Platform, Recorders, Customizable Rugged Systems
• Five IC Suppliers to Hold One-Third of 300mm Wafer Capacity in 2013
• Rambus Updates First Quarter Revenue Guidance
• Rambus and LSI Corporation Sign Patent License Agreement
• GLOBALFOUNDRIES Offers Enhanced 55nm CMOS Logic Process with ARM Next-Generation Memory and Logic IP Support for Low Voltage
• Tensilica to Demonstrate Fujitsu Smartphone that Uses Multiple Tensilica DPUs Including ConnX BBE DSP and HiFi Audio/Voice at Mobile World Congress in Barcelona

Headlines for Feb. 19, 2013

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CEVA Introduces MUST Multi-core System Technology, Adds Vector Floating-point Capabilities for CEVA-XC DSP Architecture Framework

CEVA today announced a suite of advanced processor and multi-core technologies to further enhance the CEVA-XC DSP architecture framework for high performance wireless applications including wireless terminals, small cells, access points, metro and macro base-stations.

• ARM and STMicroelectronics Join with Mathworks to Enable Code Generation, Debug and Modelling For STM32 Microcontrollers
• Tilera Announces TILE-Gx72, the World's Highest-Performance and Highest-Efficiency Manycore Processor
• LSI Introduces Axxia 5500 Communication Processors with ARM Technology for High-Performance, Power-Efficient Networks
• Kilopass Receives Frost & Sullivan Award for Non-Volatile Memory Innovator
• CEVA and Mindspeed Extend Relationship to Address LTE-Advanced Small Cells
• CAST Adds Multicast and AXI to UDP/IP Core for Streaming Media Systems
• AnSem announces the availability of an Analog Front End that makes Power Line Communication for smart grids more reliable
• New mimoOn Library for Tensilica's Baseband DSP IP Cores Speeds Up LTE and LTE-Advanced Chip Designs
• Sensory's New TrulyHandsfree 3.0 Speaker Verification and Speaker Identification Optimized Port Available on Tensilica HiFi Audio/Voice DSPs
• CEVA and Sensory Partner to Deliver Lowest Power Voice Activation Solution Based on CEVA-TeakLite-4 DSP Platform
• Lantiq Introduces Lowest Power GPON SoC Solution for SFP Optical Module Form Factor

Headlines for Feb. 18, 2013

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Creonic Announces WiGig (802.11ad) LDPC Decoder IP and Closes License Deal with Blu Wireless Technology

Creonic today announced that it closed a license deal with Blu Wireless Technology Ltd. Creonic has licensed its new forward error correction LDPC decoder IP core designed to address the WiGig 60 GHz standard (IEEE 802.11ad) to Blu Wireless Technology - a System IP company developing configurable, low power and cost 60 GHz technology for the WiGig and Wireless Backhaul markets.

• Mentor Graphics Nucleus Innovate Program Adds NXP Semiconductors and Expands Device Support
• S3 Group Launches 10 new Silicon Proven IP Cores
• Vitesse Introduces IP Cores for Consumer, Enterprise and Industrial Applications
• Toshiba to Launch New Structured Array with Short Turnaround-Time Samples
• Nuvoton NuMicro Family 32-bit Cortex-M0 MCU Debuts A New Series - NUC123

Headlines for Feb. 15, 2013

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Renesas Mobile Introduces Ground-Breaking Quad Core ARM Cortex-A15/Cortex-A7 CPU-based Communication Processor with Integrated LTE Cat-4 Modem

Based on ARM® big.LITTLE™ technology, the processor combines high performance, to deliver exciting multimedia use cases, and extreme power efficiency to extend device battery life. Samples of the MP6530 platform will be available to Tier 1 OEMs in early 2013.

• STARCHIP Announces the Sampling of its SCF670H SIM Controller to tackle the 4G/LTE market
• Univa Brings Enterprise Workload Management to ARM-based Servers, Speeding Delivery
• Bwave and Ubiso to Demonstrate World's First Licensable Multi-Standard DVB-T2 DTV Demodulation IP Subsystem Based on Tensilica's ConnX BBE16 DSP

Headlines for Feb. 14, 2013

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Elliptic Technologies Secure HDCP 2.2 Content Protection Solutions Selected by ST-Ericsson For Miracast Wi-Fi Display Applications

Elliptic Technologies today announced that ST-Ericsson has selected the Elliptic hardware-assisted tVault™ HDCP solution to support the Wi-Fi (WFD) Miracast™ wireless technology on the NovaThor™ L8540 platform for smartphones and tablets.

• Wireless Leads of Growth for OEM Semiconductor Spending in 2013
• 10 IC Product Segments to Exceed Total IC Market Growth in 2013
• Yoshida in Japan: Renesas' cuts are GloFo's gain
• Gartner Says Worldwide Mobile Phone Sales Declined 1.7 Percent in 2012
• Smartphones and Tablets Drive Continued Double-Digit Growth in MEMS Motion Sensor Market
• RFEL Launches a Video Image Stabilisation IP Core
• NXP HD Voice Processing Smartphone Software Now Available for Tensilica's HiFi Audio/Voice DSPs
• Constellations Educational Webinar Series Brings Together Leading Companies to Inform Customers

Headlines for Feb. 13, 2013

• Why we need an imaging IP core
• Tensilica and Acoustic Technologies Extend Partnership to Deliver Complete Wideband HD Voice Processing Solution for Smartphones, Tablets and Other Mobile Computing Devices
• CEVA to Showcase Industry-Leading Platform IP for Communications, Vision, Imaging, Audio and Voice at Mobile World Congress 2013
• Cadence Elects Young K. Sohn to Board of Directors

Headlines for Feb. 12, 2013

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Actions Semiconductor Licenses Arteris FlexNoC Interconnect IP for Multimedia Application Processors

Actions Semiconductor leverages silicon-proven network-on-chip (NoC) technology to ease routing congestion and improve timing in next-generation tablets

• Forte Design Systems Becomes First High-Level Synthesis Software Provider to Support IEEE 1666-2011 SystemC
• Tensilica vs. Ceva in imaging/vision IP core battle
• Xilinx Accelerates Design Productivity for High Volume Applications
• Tensilica Unveils IVP - A New Imaging/Video DSP IP Core for Mobile Handsets, DTV, Automotive and Computer Vision Applications
• Morpho and Tensilica Partner for Image Processing Solutions for Mobile Devices
• Silicon Wafer Revenues Decline in 2012
• Almalence Ports Optimized Image Processing Software onto Tensilica's New IVP Imaging/Video DSP
• Dream Chip and Tensilica Partner for Imaging/Video Development on the New IVP DSP
• Irida Labs and Tensilica Partner for Computer Vision Applications on Tensilica's New IVP Imaging/Video DSP

Headlines for Feb. 11, 2013

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Reflex CES Enters Mainstream FPGA-Prototyping Market; Offers 25-Million Gates or More ASIC Prototyping Platform With Partitioning Software

Reflex CES today introduced FPP25, a fast ASIC/SOC prototyping platform for emulating designs of up to 25-million ASIC gates using a stand-alone system.

• Nujira releases new 16-band ET RF front-end for global LTE handsets
• Synopsys Signs Multiyear Collaboration Agreement with ARM for Early Software Development for ARMv8 Processors
• Tela Innovations, Inc. Files Complaint at the U.S. International Trade Commission for Unfair Trade Practices Stemming from Patent Infringement
• Mobile and Cloud Computing Spur Tripling of Micro Server Shipments This Year
• Fujitsu, Panasonic to form fabless chip firm
• Globalfoundries commits to FDSOI process
• Intel microserver leaves door open for ARM
• Calypto's Catapult Integrates with Real Intent's Ascent Lint for Reliable RTL Implementation Flow
• OneSpin Solutions Unveils OneSpin 360 DV Product Family
• OneSpin Solutions Adds RTL-to-RTL Equivalence Checking to Product Family

Headlines for Feb. 08, 2013

• Dolphin Integration launches the kit of cells to build islets of the second generation
• TSMC January 2013 Sales Report
• Imagination Technologies: Acquisition of MIPS Technologies completed
• UMC Reports Sales for January 2013

Headlines for Feb. 07, 2013

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Cadence Expands IP Portfolio with Agreement to Acquire Cosmic Circuits

Cadence today announced an agreement to acquire Cosmic Circuits Private Limited, a provider of analog and mixed signal intellectual property (IP) cores.

• Hitachi Information & Communication Engineering Selects Forte's High-Level Synthesis Software
• Arasan Chip Systems Announces Opening of New Sales Offices in United States
• UMC Adopts Synopsys IC Validator for Pattern Matching-Based Lithography Hot-Spot Verification at 28 nm
• Pixelworks Selects Uniquify's DDR Memory Controller Subsystem IP for System Performance, Field Reliability in its 4Kx2K Ultra High Definition TVs, Digital Projector Solutions
• Flash Reliability IP Provider, Proton Digital Systems Completes $2 Million Funding Round
• LeadingUI chooses Cortus APS1 Processor for Touchscreen Applications
• MPEG HEVC - The next major milestone in MPEG video history is achieved
• MoSys Unveils New Bandwidth Engine IC with On-Board Macro Functions for 400G Network Equipment

Headlines for Feb. 06, 2013

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Athena Announces Fastest Public Key Accelerator Core

The Athena Group today announced the industry’s fastest public key (PK) accelerator core. The T6421 employs Athena’s patented arithmetic technology and patented cryptographic architecture to deliver extraordinary throughput across the entire spectrum of PK operations, and is specifically optimized for RSA-2048.

• SMIC Reports 2012 Fourth Quarter Results
• GUC Monthly Sales Report - January 2013
• ARM rates FDSOI process as 'good technology'
• Chip market seen contracting again in 2013
• Big-little is sweet 16
• GLOBALFOUNDRIES and Samsung Support New Cadence Virtuoso Advanced Node for 20- and 14nm Processes
• Faraday Reported 2012 Fourth Quarter Results
• Semiconductors Down 2.7% in '12, May Grow 7.5% in '13
• Silicon Image Announces Fourth Quarter and Fiscal Year 2012 Earnings
• MIPS Stockholders to Receive $8.01 in Aggregate Net Proceeds from Recapitalization and Merger

Headlines for Feb. 05, 2013

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ARM Holdings PLC Reports Results For The Fourth Quarter And Full Year 2012

ARM Holdings plc announces its unaudited financial results for the fourth quarter and full year ended 31 December 2012.

• GLOBALFOUNDRIES Details 14nm-XM FinFET Technology Performance, Power and Area Efficiency with a Dual-core Cortex-A9 Processor Implementation
• GLOBALFOUNDRIES and Cyclos Semiconductor Partner to Develop High-Performance, Low-Power ARM Cortex-A15 Processors Using Resonant Clock Mesh Technology
• GLOBALFOUNDRIES and Rambus Collaborate To Develop Broad IP Portfolio for 14nm-XM FinFET Process Technology
• GLOBALFOUNDRIES and Synopsys Partner To Provide Comprehensive Design Environment for Foundry's 14 nm-XM FinFET Offering
• GLOBALFOUNDRIES To Offer Adapteva's Processor IP For 28nm SoC Designs
• Cadence and GLOBALFOUNDRIES Collaborate to Enable Custom/Analog and Digital Design of 20nm Manufacturing Process
• Semiconductor R&D Spending Rises 7% Despite Weak Market
• Analog Bits IP Now Shipping in Microsemi's SmartFusion2 SoC FPGAs IP products dramatically reduce power and area
• Phison Licenses Tensilica's Dataplane Processor (DPU) for NAND Flash Memory Controllers and SSD Applications
• Calypto Announces New President and CEO Sanjiv Kaul

Headlines for Feb. 04, 2013

• TI power management front-end chip increases battery run-time in ARM Cortex A15-based designs
• Semiconductor Industry Posts Near-Record Sales Total in 2012
• TU Dresden Realized 28nm Low Power Test Chip with Tensilica Processor and RacyICs Power Management in GLOBALFOUNDRIES Process
• Imagination submits PowerVR Series6 cores for OpenGL ES 3.0 conformance
• TOSHIBA Develops High Speed NANO FLASH-100 Flash Memory for ARM Core Based Microcontrollers
• Atmel Introduces New Family of Cortex-A5 Processor-Based MPUs For Embedded Industrial and Consumer Applications