Die-to-Die (D2D) Interconnect
ARINC664 Switch IP Core
Temperature Sensor with Digital Output (High accuracy thermal sensing for reliability and optimisation), TSMC N6
MIPI D-PHY/LVDS Combo CSI-2 RX (Receiver) in TSMC 28HPC+
Packetcraft Delivers Bluetooth Software Enabling Channel Sounding to Early Access Licensees
TSMC's A16 Process Moves Goalposts in Tech-Leadership Game
Altera in negotiation on private equity partner
Synopsys 3DIO Solution for Multi-Die Integration (2.5D/3D)
SoC NoCs: Homegrown or Commercial Off-the-Shelf?
From a Lossless (~1.5:1) Compression Algorithm for Llama2 7B Weights to Variable Precision, Variable Range, Compressed Numeric Data Types for CNNs and LLMs
What You Need to Know About Gate-All-Around Designs
Open Standard Clarifies the Role of UWB vs Bluetooth
USB4 Version 2.0 - Low Power with Gen4 Link
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