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Findings from the Semicast study on the global market for 32/64-bit microcontrollers (MCUs) and embedded microprocessors (eMPUs) show that automotive and industrial (including medical) applications are forecast to be the two key growth sectors, with total revenues for ARM-based MCUs/eMPUs set to increase at a CAGR of 21% over the period 2007-2013. Revenue growth for ARM-based MCUs is forecast to be driven in particular by the introduction of low cost parts based on the ARM Cortex M3 and M0 cores.
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ARM announces its unaudited financial results for the first quarter ended 31 March 2009. Revenues at $120.9m down 10% year-on-year. 17 processor licenses.
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Faraday today announced that their PCIe GenII PHY, developed based on the PCI Express 2.0 specification, has passed PCI-SIG® APAC compliance test in April. This PHY is designed for UMC 90nm process and now available for ASIC customers.
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NEC Electronics, Renesas Technology, NEC Corporation, Hitachi, and Mitsubishi Electric today agreed to enter into negotiations to integrate business operations at NEC Electronics and Renesas.
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DCD releases World's smallest and fastest 8051 core. The 7150 ASIC gates for complete system including 8051-CPU, full duplex UART, Timers 0&1, Advanced Power Management Unit, eight I/O lines, eight external interrupts INT0-INT7 and 2-wire DoCD on-chip debugger is the best achievement on the IP Market. DT8051 runs Dhrystone 2.1 benchmark program 8.1 times faster than the original 80C51 at the same frequency.
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Jungo today announced that its USBware™ for SuperSpeed USB 3.0 stacks will be integrated with the Synopsys DesignWare SuperSpeed USB IP offering. The result is a complete turnkey solution for silicon manufacturers.
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ARM and Mindspeed today announced that Mindspeed has licensed the ARM® Cortex™-A9 MPCore™ processor for use in their next generation multiservice networking platforms, designed to support voice and data services across wireline and wireless networks.
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The new flow is available now for 65nm designs. Integrated Sign-Off Flow is an automated RTL to GDSII chip implementation flow that tightly integrates all process-specific items including pre-qualified library and IP, selected EDA tools, production-quality flow, advanced design methodology, and TSMC foundry technology files that have been proven and refined over hundreds of applications.
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ARM today announced the availability of the industry’s most comprehensive IP platform for TSMC’s 40nm G manufacturing process. This latest silicon-validated physical IP from ARM enables cost-effective development of performance driven consumer devices requiring advanced functionality without increasing power consumption.
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SMIC and Dolphin Integration announced today their partnership for the release of the latest generation of digital-to-analog audio converters that, utilizing Dolphin's expertise, feature ultra-low power consumption.
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PLDA today announced that it has begun shipping the first SuperSpeed USB Host Bus Adapter (HBA) development platform. This HBA platform will enable leading-edge companies to develop and test USB 3.0 semiconductor designs or USB 3.0 software stacks more easily and efficiently, helping get them to market quicker.
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Synopsys today announced that it has enhanced its DesignWare® IP for the ARM® AMBA® 3 AXI™ interconnect with the industry's first hybrid architecture implementation, enabling dedicated high-performance and shared low-performance channels to be combined within a single AMBA 3 AXI on-chip interconnect.
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Lead Tech Design, which specializes in the design of ASIC/FPGA System-on-Chip (SoCs) and embedded software for Linux and Linux hard real time with Xenomai, is extending its offering with aRDAC, a brand new range of configurable microcontrollers, guaranteeing performance of 1 MIPS/MHz.
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Vivante today announced that C2 Microsystems has selected Vivante GPU IP technology to bring feature-rich GUI and on-screen display capabilities to their high performance SoC media processors.
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Arasan announced the immediate availability of the Mobile Industry Processor Interface (MIPI(r)) UniPro Controller IP, a layered, high-speed protocol that provides connectivity between applications processors and wireless, multimedia and mobile chipsets. As a leading provider of mobile IP, Arasan continues to strengthen its Strategic Mobile Initiative by expanding its MIPI IP portfolio with the UniPro IP.
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RMI’s next generation architecture will offer much greater processor performance than that available from any other embedded processor in the market today. The combination of the improved design, along with frequencies greater than 2.0 GHz enabled by the 40nm process node, will result in significant performance per watt advantages for RMI’s customers.
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Rambus today announced it has acquired a number of patents from Inapac Technology, Inc. to broaden its offerings for the mobile memory market. These patented innovations complement the high-bandwidth, low-power memory technologies developed by Rambus as part of its Mobile Memory Initiative, announced earlier this year.
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Digital Core Design (DCD) today releases the 5th generation of World's fastest and most popular 8051 core. DP8051 runs Dhrystone 2.1 benchmark program 11.45 to 14.74 times faster than the original 80C51 at the same frequency.
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Gennum today announced that its Snowbush IP group has developed a SATA 6 gigabits per second (Gb/s) physical layer (PHY) IP block. The new IP also satisfies the stringent requirements of the latest Serial Attached SCSI (SAS) standard, SAS 2.0 (SAS-2). The SATA/SAS IP is being offered for manufacture in a variety of 65-nm and 45-/40-nm processes, including TSMC, as well as Common Platform Alliance members IBM, Chartered and Samsung.
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Altera today announced its 40-nm Stratix® IV GX FPGAs are compliant with version 2.0 of the PCI Express® (PCIe®) standard, providing users a comprehensive PCIe solution for high-bandwidth applications. Stratix IV GX FPGAs achieved compliance for PCIe 1.1 and PCIe 2.0 up to x8 lane configurations for end-point applications. Stratix IV GX FPGAs are shipping today with PCIe 2.0 hard intellectual property (IP) blocks.
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TES today announced that NEC Electronics Corporation has signed a license agreement for TES's D/AVE-3D Graphics IP for use in NEC Electronics' multifunction system-on-chip (SoC), targeting automotive applications. D/AVE-3D supports industry standard OpenGL-ES 1.1 and OpenVG 1.01 Graphics API.
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